Step and Flash Imprint Lithography for Semiconductor High Volume Manufacturing?

被引：19

作者：

Malloy, M. ^{[1
]}

Litt, L. C. ^{[1
]}

机构：

[1] SEMATECH, Albany, NY 12203 USA

来源：

ALTERNATIVE LITHOGRAPHIC TECHNOLOGIES II | 2010年 / 7637卷

关键词：

Nanoimprint; NIL; Step and Flash; SFIL; HVM; UV-NIL;

D O I：

10.1117/12.846617

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Step and Flash Imprint Lithography (SFIL), a form of ultraviolet nanoimprint lithography (UV-NIL), is recognized for its resolution and patterning abilities. It is one of the few next generation lithography techniques capable of meeting the resolution requirements of future semiconductor devices. However, many integration issues such as defectivity, throughput, and overlay must be resolved before SFIL can be used for semiconductor high volume manufacturing (HVM). This paper discusses the current status of SFIL, including the process and templates, and shows where more industry collaboration is needed to solve the most critical issues.

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