Advanced dicing technology for semiconductor wafer - Stealth dicing

被引：136

作者：

Kumagai, Masayoshi ^{[1
]}

Uchiyama, Naoki

Ohmura, Etusji

Sugiura, Ryuji

Atsumi, Kazuhiro

Fukumitsu, Kenshi

机构：

[1] Hamamatsu Photon KK, Hamamatsu, Shizuoka, Japan

[2] Hamamatsu Photon KK, Hamamatsu, Shizuoka, Japan

[3] Hamamatsu Photon KK, Hamamatsu, Shizuoka, Japan

[4] Hamamatsu Photon KK, Hamamatsu, Shizuoka, Japan

[5] Osaka Univ, Suita, Osaka, Japan

来源：

关键词：

dicing; dry processing; laser processing; system in package; thin/ultra-thin wafer;

D O I：

10.1109/TSM.2007.901849

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：259 / 265

页数：7

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REDFIELD, D .