Direct media exposure of MEMS multi-sensor systems using a potted-tube packaging concept

被引：14

作者：

Hyldgard, Anders ^{[1
]}

Birkelund, Karen ^{[1
]}

Janting, Jakob ^{[2
]}

Thomsen, Erik V. ^{[1
]}

机构：

[1] Tech Univ Denmark, MIC, DK-2800 Lyngby, Denmark

[2] DELTA, DK-2970 Horsholm, Denmark

来源：

SENSORS AND ACTUATORS A-PHYSICAL | 2008年 / 142卷 / 01期

关键词：

packaging; multi-sensor; direct exposure; potting; harsh environment;

D O I：

10.1016/j.sna.2007.02.024

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A packaging concept for Data Storage Tags is presented. A potted-tube packaging concept, using a polystyrene tube and different epoxies as filling material that allows for direct sensor exposure is investigated. The curing temperature, water uptake and the diffusion coefficient for water in the filling material is measured. The packaging concept is used to encapsulate a microfabricated multi-sensor (measuring temperature, water conductivity, pressure and light intensity). The direct exposure of the sensors results in high sensitivity and fast response time. The design of an elongated multi-sensor is described and effectiveness of the packaging is demonstrated with the precise measurement of water conductivity using the packaged multi-sensor. The packaging concept is very promising for high accuracy measurements in harsh environments. (c) 2007 Elsevier B.V. All rights reserved.

引用

页码：398 / 404

页数：7

共 13 条

[1]

Adams R.D., 1997, STRUCTURAL ADHESIVE

[2]

Crank J., 1956, The Mathematics of Diffusion

[3]

Hyldgaerd A, 2005, IEEE SENSOR, P1124

[4]

Hyldgård A, 2005, PROC IEEE MICR ELECT, P303