共 33 条
[2]
Seed-less Copper Electrochemical Deposition on PVD resistive substrates as a Replacement/Enhancement for PVD Cu Seed Layers in HAR TSVs
[J].
ELECTROCHEMICAL ENGINEERING FOR THE 21ST CENTURY (DEDICATED TO RICHARD C. ALKIRE),
2010, 28 (29)
:77-87
[4]
Impact of "Terminal Effect" on Cu Plating: Theory and Experimental Evidence
[J].
SEMICONDUCTORS, METAL OXIDES, AND COMPOSITES: METALLIZATION AND ELECTRODEPOSITION OF THIN FILMS AND NANOSTRUCTURES,
2010, 25 (27)
:185-194
[5]
Advanced processing techniques for through-wafer interconnects
[J].
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B,
2004, 22 (01)
:248-256
[6]
Chen L., 2003, U.S.Pat., Patent No. [6,638,410 B2, 6638410]
[7]
CHEN L, 2000, SEMICONDUCTOR FABTEC, V267, P267
[8]
GAU WC, 2000, J VAC SCI TECHNOL A, V18, P2
[9]
HISS TG, 1973, AICHE J, V19, P698, DOI 10.1002/aic.690190404