Miniaturization of electromagnetic bandgap (EBG) structures with high-permeability magnetic metal sheet

被引:0
作者
Toyota, Yoshitaka [1 ]
Iokibe, Kengo [1 ]
Koga, Ryuji [1 ]
Engin, Arif Ege [2 ]
Kim, Tae Hong [2 ]
Swaminathan, Madhavan [2 ]
机构
[1] Okayama Univ, Dept Commun Network Engn, Okayama, Japan
[2] Packaging Res Ctr, Sch Elect & Comp Engn, Georgia Inst Technol, Atlanta, GA USA
来源
2007 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY: WORKSHOP AND TUTORIAL NOTES, VOLS 1-3 | 2007年
关键词
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Electromagnetic bandgap (EBG) structures in a pair of parallel planes are quite effective for suppressing simultaneous switching noise, but they are too large to be applied to compact electronic devices. To miniaturize the EBG structures, we investigated an approach to interpose a high-permeability magnetic metal sheet between the parallel planes. The experimental results show that high permeability of the sheet shifts the stopband towards lower frequencies. This suggests that such sheets contribute to the miniaturization of the EBG structures. In addition, it is demonstrated that the imaginary part of the permeability can expand the stopband.
引用
收藏
页码:55 / +
页数:2
相关论文
共 7 条
  • [1] Metallo-dielectric electromagnetic bandgap structures for suppression and isolation of the parallel-plate noise in high-speed circuits
    Abhari, R
    Eleftheriades, GV
    [J]. IEEE TRANSACTIONS ON MICROWAVE THEORY AND TECHNIQUES, 2003, 51 (06) : 1629 - 1639
  • [2] [Anonymous], MICROWAVE ENG
  • [3] A novel electromagnetic bandgap (EBG) structure for mixed-signal system applications
    Choi, J
    Govind, V
    Swaminathan, M
    [J]. RAWCON: 2004 IEEE RADIO AND WIRELESS CONFERENCE, PROCEEDINGS, 2004, : 243 - 246
  • [4] Isolation in mixed-signal systems using a novel electromagnetic bandgap (EBG) structure
    Choi, JW
    Govind, V
    Swaminathan, M
    Wan, LX
    Doraiswami, R
    [J]. ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2004, : 199 - 202
  • [5] Methods to reduce radiation from split ground planes in RF and mixed signal packaging structures
    Moran, TE
    Virga, KL
    Aguirre, G
    Prince, JL
    [J]. IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2002, 25 (03): : 409 - 416
  • [6] Electromagnetic interference (EMI) reduction from printed circuit boards (PCB) using electromagnetic bandgap structures
    Shahparnia, S
    Ramahi, OM
    [J]. IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, 2004, 46 (04) : 580 - 587
  • [7] Size reduction of electromagnetic bandgap (EBG) structures with new geometries and materials
    Toyota, Yoshitaka
    Engin, A. Ege
    Kim, Tae Hong
    Swaminathan, Madhavan
    Bhattacharya, Swapan
    [J]. 56TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE 2006, VOL 1 AND 2, PROCEEDINGS, 2006, : 1784 - +