The recombination activity of interstitial chromium (Cr-i) and pairs of interstitial chromium and substitutional boron (CriBs) in crystalline silicon is studied by combining temperature- and injection-dependent lifetime and deep-level transient spectroscopy measurements on intentionally chromium-contaminated n- and p-type silicon wafers. Cr-i as well as CriBs pairs are found to be one order of magnitude less recombination active than widely assumed. In the case of Cr-i, a defect energy level of E-C-E-t=0.24 eV, an electron capture cross section of sigma(n)=2 x 10(-14) cm(2), and a hole capture cross section of sigma(p)=4 x 10(-15) cm(2) are determined. For CriBs pairs, measurements on boron-doped p-type silicon result in E-t-E-V=0.28 eV, sigma(n)=5 x 10(-15) cm(2), and sigma(p)=1 x 10(-14) cm(2). Theoretical calculations using the Shockley-Read-Hall theory show that it depends crucially on the doping concentration whether Cr-i or CriBs is the more active recombination center. Using a calibration function calculated from the defect parameters determined in this study, lifetime changes measured before and after thermal dissociation of CriBs pairs can be used to determine the interstitial chromium concentration in boron-doped silicon. (c) 2007 American Institute of Physics.