A Review on Solder Reflow and Flux Application for Flip Chip

被引：4

作者：

Suppiah, Sarveshvaran ^{[1
]}

Ong, Nestor Rubio ^{[2
]}

Sauli, Zaliman ^{[1
]}

Sarukunaselan, Karunavani ^{[1
]}

Alcain, Jesselyn Barro ^{[2
]}

Visvanathan, Susthitha Menon ^{[3
]}

Retnasamy, Vithyacharan ^{[1
]}

机构：

[1] Univ Malaysia Perlis, Sch Microelect Engn, Kampus Alam, Arau 02600, Perlis, Malaysia

[2] Univ Santo Tomas, Fac Engn, Manila, Philippines

[3] UKM, Inst Microengn & Nanoelect IMEN, Ukm Bangi 43600, Selangor, Malaysia

来源：

3RD ELECTRONIC AND GREEN MATERIALS INTERNATIONAL CONFERENCE 2017 (EGM 2017) | 2017年 / 1885卷

关键词：

D O I：

10.1063/1.5002458

中图分类号：

X [环境科学、安全科学];

学科分类号：

08 ; 0830 ;

摘要：

This paper encompassed of the evolution and key findings, critical technical challenges, solutions and bonding equipment of solder reflow in flip chip bonding. Upon scrutinizing researches done by others, it can be deduced that peak temperature, time above liquidus, soak temperature, soak time, cooling rate and reflow environment played a vital role in achieving the desired bonding profile. In addition, flux is also needed with the purpose of removing oxides/contaminations on bump surface as well as to promote wetting of solder balls. Electromigration and warpage are the two main challenges faced by solder reflow process which can be overcome by the advancement in under bump metallization (UBM) and substrate technology. The review is ended with a brief description of the current equipment used in solder reflow process.

引用

页数：7

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