New organosoluble polyimides with low dielectric constants derived from bis[4-(2-trifluoromethyl-4-aminophenoxy)phenyl] diphenylmethylene

A new kink diamine with trifluoromethyl group on either side, bis[4(2-trifluoromethyl-4-aminophenoxy)phenyl]diphenylmethane(BTFAPDM), was reacted with various aromatic dianhydrides to prepare polyimides via poly (amic acid) precursors followed by thermal or chemical imidization. Polyimides were prepared using 3,3', 4,4'-biphenyltetracarboxylic dianhydride(1), 4,4'-oxydiphthalic anhydride(2), 3,3',4,4'-benzophenonetetracarboxylic dianhydride(3), 4,4'-sulfonyldiphthalic anhydride(4), and 4,4'-hexafluoroisopropylidene-diphathalic anhydride(5). The fluoro-polyimides exhibited low dielectric constants between 2.46 and 2.98, light color, and excellent high solubility. They exhibited glass transition temperatures between 227 and 253degreesC, and possessed a coefficient of thermal expansion (CTE) of 60-88 ppm/degreesC. Polymers PI-2, PI-3, PI-4, PI-5 showed excellent solubility in the organic solvents: N-methyl-2-pyrrolidinone (NMP), N,N-dimethylacetamide (DMAc), N,N-dimethylformamide (DMF), dimethyl sulfoxide (DMSO), pyridine and tetrahydrofuran (THY). Inherent viscosity of the polyimides were found to range between 0.58 and 0.72 dLg-1. Thermogravimetric analysis of the polyimides revealed a high thermal stability decomposition temperature in excess of 500degreesC in nitrogen. Temperature at 10% weight loss was found to be in the range 506-563degreesC and 498-557degreesC in nitrogen and air, respectively. The polyimide films had a tensile strength in the range 75-87 MPa; tensile modulus, 1.5-2.2 GPa; and elongation at break, 6-7%.