Adherence of self-assembled monolayers on gold and their effects for high-performance anisotropic conductive adhesives

被引：55

作者：

Li, Y ^{[1
]}

Moon, KS

Wong, CP

机构：

[1] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA

[2] Georgia Inst Technol, Packing Res Ctr, Atlanta, GA 30332 USA

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2005年 / 34卷 / 03期

基金：

美国国家科学基金会;

关键词：

anisotropic conductive adhesives (ACAs); self-assembled monolayer (SAM); current density; thermostability;

D O I：

10.1007/s11664-005-0212-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

To improve the electrical property of the anisotropic conductive adhesive (ACA) joints, self-assembled monolayer (SAM) compounds are introduced into the interface between the metal filler and the substrate bond pad. The formation of the SAM on gold and the thermal stability were investigated by measuring the contact angles of SAM compounds with a hydrophilic or hydrophobic tail groups such as octadecanethiol (ODT), mercpatoacetic acid (MAA), and 1,4-benzenedithiol (dithiol) on the Au surface. Epoxy resins with two different curing temperatures were used as polymer matrices of the ACA formulations. The SAM-treated ACA joints showed much lower resistance at the same applied current than nontreated joints, and the effect on the low curing temperature epoxy matrices was more significant.

引用

页码：266 / 271

页数：6

共 12 条

[1]

Beck D.P., 1958, Patent, Patent No. [US2866057, 2866057]

[2] Are single molecular wires conducting? [J].

Bumm, LA ;

Arnold, JJ ;

Cygan, MT ;

Dunbar, TD ;

Burgin, TP ;

Jones, L ;

Allara, DL ;

Tour, JM ;

Weiss, PS .

SCIENCE, 1996, 271 (5256) :1705-1707

[3]

Gilleo K., 1995, Soldering & Surface Mount Technology, P12, DOI 10.1108/eb037885

[4]

HARISS PG, 1995, SOLDERING SURFACE MO, V20, P19

[5] Reliability of electrically conductive adhesive joints for surface mount applications: A summary of the state of the art [J].

Jagt, JC .

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY PART A, 1998, 21 (02) :215-225

[6] Anisotropic adhesives for flip-chip bonding [J].

Kivilahti, J ;

Savolainen, P .

JOURNAL OF ELECTRONICS MANUFACTURING, 1995, 5 (04) :245-252

[7]

Matz K.R., 1958, Patent, Patent No. [US2849631, 2849631]

[8] Adhesion improvement of thermoplastic-based isotropic conductive adhesives under humid environment using self-assembled monolayer compounds [J].

Moon, KS ;

Rockett, C ;

Wong, CP .

JOURNAL OF ADHESION SCIENCE AND TECHNOLOGY, 2004, 18 (02) :153-167

[9]

Ogunjimi A. O., 1992, Journal of Electronics Manufacturing, V2, P109, DOI 10.1142/S0960313192000145

[10]

Wolfson H., 1956, United States of America Patent, Patent No. [US 2774747 A, 2774747]

← 1 2 →