Bonding Layer Microstructures and Mechanical Behavior of Sapphire/Sapphire Joints Diffusion-bonded using MgO-Al2O3-SiO2 Interlayer

被引:6
作者
Zhang, Lunyong [1 ]
Xing, Dawei [1 ]
Sun, Jianfei [1 ]
Zuo, Hongbo [2 ]
Wang, Tiancheng [2 ]
Han, Jiecai [2 ]
机构
[1] Harbin Inst Technol, Sch Mat Sci & Engn, Harbin 150006, Peoples R China
[2] Harbin Inst Technol, Ctr Composite Mat, Harbin 150006, Peoples R China
关键词
TRANSIENT-LIQUID-PHASE; SINTERING CRYSTALLINE SOLIDS; ALUMINA; GROWTH; CERAMICS; COPPER; DENSIFICATION; STRENGTH; FRACTURE; MODELS;
D O I
10.1111/j.1744-7402.2010.02557.x
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
The bonding layer microstructures and their effects on fracture behaviors of sapphire joined using MgO (0.5%)-Al2O3 (94%)-SiO2 (5.5%) interlayer are analyzed. The results indicate that the bonding layer is composed by facetted Al2O3 grains and pores and they are controlled by joining conditions. The fracture mode is mainly intergranular for the pieces with fine grains and changes into cleavage fracture as the grain size increases. Optimal microstructures can be obtained under the condition of 1700 degrees C, holding time of 1.5 h and pressure of 3 Mpa and the flexure strength corresponding M-{10 (1) over bar0} plane bonded pieces may be beyond 250 MPa and A-{11 (2) over bar0} plane bonded pieces may reach above 300 MPa.
引用
收藏
页码:1183 / 1191
页数:9
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