A compact 3-D VLSI classifier using bagging MP threshold network ensembles

被引:40
作者
Bermak, A [1 ]
Martinez, D
机构
[1] Hong Kong Univ Sci & Technol, Dept Elect Engn & Elect, Kowloon, Hong Kong, Peoples R China
[2] LORIA, F-54506 Vandoeuvre Les Nancy, France
来源
IEEE TRANSACTIONS ON NEURAL NETWORKS | 2003年 / 14卷 / 05期
关键词
bagging; decision trees; threshold networks; very large-scale integration (VLSI); three-dimensional (3-D) packaging technology;
D O I
10.1109/TNN.2003.816362
中图分类号
TP18 [人工智能理论];
学科分类号
081104 ; 0812 ; 0835 ; 1405 ;
摘要
A bagging ensemble consists of a set of classifiers trained independently and-combined by a majority vote. Such a combination improves generalization performance but can require. large amounts of memory and computation, a serious drawback for addressing portable real-time pattern recognition applications. We report here a compact three-dimensional (3-D) multiprecision very large-scale integration (VLSI) implementation of a bagging ensemble. In our circuit, individual classifiers are decision trees implemented as threshold networks-one layer of threshold logic units (TLUs) followed by combinatorial logic functions. The hardware was fabricated using 0.7-mum CMOS technology and packaged using MCM-V micro-packaging technology. The 3-D chip implements up to 192 TLUs operating at a speed of up to 48GCPPS and implemented in a volume of (w x L x h) = (2 x 2 x 0.7) cm(3). The 3-D circuit features a high level of programmability and flexibility offering the possibility to make an efficient use of the hardware resources in order to reduce the power consumption. Successful operation of the 3-D chip for various precisions and ensemble sizes is demonstrated through an electronic nose application.
引用
收藏
页码:1097 / 1109
页数:13
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