共 50 条
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- [42] Power Saving and Noise Reduction of 28nm CMOS RF System Integration Using Integrated Fan-Out Wafer Level Packaging (InFO-WLP) Technology 2015 INTERNATIONAL 3D SYSTEMS INTEGRATION CONFERENCE (3DIC 2015), 2015,
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- [46] A 50 Mb/s Full HBC TRX with Adaptive DFE and Variable-Interval 3x Oversampling CDR in 28nm CMOS Technology for A 75 cm Body Channel Moving at 0.75 Cycle/sec ESSCIRC 2022- IEEE 48TH EUROPEAN SOLID STATE CIRCUITS CONFERENCE (ESSCIRC), 2022, : 213 - 216
- [47] A Fully-Passive 4-Channel RF Beamformer with Ultra-Low Insertion Loss at 12GHz X/Ku-band for Low-Power Applications in 28nm CMOS 2024 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM, IMS 2024, 2024, : 935 - 938
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- [49] MISIMO: A Multi-Input Single-Inductor Multi-Output Energy Harvester Employing Event-Driven MPPT Control to Achieve 89% Peak Efficiency and a 60,000x Dynamic Range in 28nm FDSOI 2018 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE - (ISSCC), 2018, : 144 - +
- [50] A 1.1W/mm2-Power-Density 82%-Efficiency Fully Integrated 3:1 Switched-Capacitor DC-DC Converter in Baseline 28nm CMOS Using Stage Outphasing and Multiphase Soft-Charging 2017 IEEE INTERNATIONAL SOLID-STATE CIRCUITS CONFERENCE (ISSCC), 2017, : 178 - 178