The Investigation of Semiconductor Shipping Bag Reliability

被引：0

作者：

Gao, Hailin Jonson ^{[1
]}

Zhang, Xueliang Ruben ^{[1
]}

Yu, Yanju Lisa ^{[1
]}

Chang, Kaiyuan Kevin ^{[1
]}

Chien, Wei-Ting Kary ^{[1
]}

机构：

[1] Semicond Mfg Int Corp, Corp Q&R, Shanghai 201203, Peoples R China

来源：

2015 IEEE INTERNATIONAL CONFERENCE ON INDUSTRIAL ENGINEERING AND ENGINEERING MANAGEMENT (IEEM) | 2015年

关键词：

Shipping bag; reliability; puncture strength; Tensile strength;

D O I：

暂无

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The shipping bag used in semiconductor industry is very important as a protection guard of products. It provides good protection for finished products after shipping and the handling by the final users. Among various shipping bags, Moisture Barrier Bag (MBB) is the most widely used type in the semiconductor industry because of its high reliability. However, with the technology advancement, the packing of a large size of IC wafers is inevitable, which brings a new challenge to its resistance to a greater load of shipping and dropping. To reduce the failure rate of MBB leakage during shipment, we evaluate the physical and tensile strength of the shipping bag composed of different films. We significantly improved MBB by optimizing its raw material, which is the first time such approach with plausible results is reported.

引用

页码：935 / 938

页数：4