Effects of cold work, stress and temperature on the dielectric behavior of copper

被引:12
|
作者
Xi, Xiang [1 ]
Chung, D. D. L. [1 ]
机构
[1] SUNY Buffalo, Univ Buffalo, Dept Mech & Aerosp Engn, Composite Mat Res Lab, Buffalo, NY 14260 USA
关键词
Copper; Cold work; Electret; Permittivity; Sensing; ELECTRIC PERMITTIVITY; CARBON-FIBER; EXFOLIATED-GRAPHITE; PIEZOELECTRICITY; PIEZORESISTIVITY; METALS; COMPOSITES; EVOLUTION; TEXTURE; MATRIX;
D O I
10.1016/j.matchemphys.2021.124793
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
This work reports for the first time the effect of cold work (mechanical rolling) on the dielectric behavior of a conductive dielectric, namely copper (not poled). The positive end of the electret's voltage is where the rollinginduced plastic flow originates. Cold work (37%) increases the relative permittivity kappa (2 kHz) from 2380 to 2660, and increases the fraction of carriers that participate in the electret through interaction with the atoms from 4.8 x 10(-6) to 4.3 x 10(-4), in addition to increasing the electret's DC electric field E, power density and energy density by 1730%, 30,500% and 135,000%, respectively. The cold work slows down the electret discharge/charge, but decreases the discharge/charge time per unit participating charge. Annealing after cold work greatly decreases E and the power density. The microstructure, which is obviously affected by cold work and annealing, greatly affects the behavior. During short-circuited discharge and subsequent open-circuited charge, E changes reversibly. The E increases linearly with increasing inter-electrode distance. The electret is also supported by the directional asymmetry in the polarization-induced apparent resistance upon polarity reversal. The effects of tensile stress (elastic regime) and temperature on the dielectric behavior are also reported. The cold work weakens the positive piezopermittivity (the fractional change in kappa per unit strain decreasing from 4.0 x 10(3) to 9.7 x 10(2)), negative piezoelectret (the piezoelectret coefficient changing from -1.64 x 10(-9) pC/N to -2.82 x 10(-10) pC/N) and negative piezoresisitivty (the gage factor changing from -342 to -167). This work also reports the pyropermittivity (change of kappa with temperature) and pyroelectret (change of E with temperature), which are useful for temperature sensing and thermal energy harvesting. The dielectric/electret behavior is strengthened by mild heating. Upon heating from 20 degrees C to 70 degrees C, kappa (2 kHz) increases reversibly from 2660 to 3200 and E (DC) increases reversibly by 800%, corresponding to pyroelectret coefficient 9.2 x 10(-14) C/(m(2). K).
引用
收藏
页数:24
相关论文
共 50 条
  • [1] Effects of cold work, stress and temperature on the dielectric behavior of copper
    Xi, Xiang
    Chung, D.D.L.
    Materials Chemistry and Physics, 2021, 270
  • [2] The Effects of Prior Cold Work on the Shock Response of Copper
    Millett J.C.F.
    Higgins D.L.
    Chapman D.J.
    Whiteman G.
    Jones I.P.
    Chiu Y.-L.
    Journal of Dynamic Behavior of Materials, 2018, 4 (2) : 211 - 221
  • [3] On the dynamically stored energy of cold work in pure single crystal and polycrystalline copper
    Rittel, D.
    Kidane, A. A.
    Alkhader, M.
    Venkert, A.
    Landau, P.
    Ravichandran, G.
    ACTA MATERIALIA, 2012, 60 (09) : 3719 - 3728
  • [4] DIFFUSION OF COPPER THROUGH DIELECTRIC FILMS UNDER BIAS TEMPERATURE STRESS
    RAGHAVAN, G
    CHIANG, C
    ANDERS, PB
    TZENG, SM
    VILLASOL, R
    BAI, G
    BOHR, M
    FRASER, DB
    THIN SOLID FILMS, 1995, 262 (1-2) : 168 - 176
  • [5] Effect of cold work and processing orientation on stress corrosion cracking behavior of alloy 600
    Moshier, WC
    Brown, CM
    CORROSION, 2000, 56 (03) : 307 - 320
  • [6] Temperature-induced dielectric and electrical behavior of Cs/HPC-copper vanadate nanocomposites
    Al-kalali, N. A.
    Abdelghany, A. M.
    Bin Anooz, S.
    Abdelaziz, M.
    Oraby, A. H.
    PHYSICA SCRIPTA, 2024, 99 (10)
  • [7] The Work Softening Behavior of Pure Mg Wire during Cold Drawing
    Sun, Liuxia
    Bai, Jing
    Xue, Feng
    Chu, Chenglin
    Meng, Jiao
    MATERIALS, 2018, 11 (04):
  • [8] Effect of cold work on the stress corrosion cracking behavior of Alloy 690 in supercritical water environment
    Chen, Kai
    Du, Donghai
    Gao, Wenhua
    Guo, Xianglong
    Zhang, Lefu
    Andresen, Peter L.
    JOURNAL OF NUCLEAR MATERIALS, 2018, 498 : 117 - 128
  • [9] Effects of copper on dielectric properties of E. coli cells
    Bai, Wei
    Zhao, Kongshuang
    Asami, Koji
    COLLOIDS AND SURFACES B-BIOINTERFACES, 2007, 58 (02) : 105 - 115
  • [10] Effect of temperature on stress relaxation behavior of pure copper with continuous fiber crystal structure
    Jin, Wei
    Huang, Hongfeng
    Fu, Shanshan
    Gan, Chunlei
    Li, Xiaohui
    Igor, Lozikov
    Zhang, Zhibo
    MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2025, 929