Evaluation of threading dislocation density of strained Ge epitaxial layer by high resolution x-ray diffraction

被引:14
作者
Miao, Yuan-Hao [1 ]
Hu, Hui-Yong [1 ]
Li, Xin [1 ]
Song, Jian-Jun [1 ]
Xuan, Rong-Xi [1 ]
Zhang, He-Ming [1 ]
机构
[1] Xidian Univ, Sch Microelect, Key Lab Wide Band Gap Semicond Mat & Devices, Xian 710071, Shaanxi, Peoples R China
基金
中国国家自然科学基金;
关键词
HR-XRD; RPCVD; threading dislocation density (TDD); etching pit density (EPD); CHEMICAL-VAPOR-DEPOSITION; SI(001); QUALITY; GROWTH; SI; THICKNESS;
D O I
10.1088/1674-1056/26/12/127309
中图分类号
O4 [物理学];
学科分类号
0702 ;
摘要
The analysis of threading dislocation density (TDD) in Ge-on-Si layer is critical for developing lasers, light emitting diodes (LEDs), photodetectors (PDs), modulators, waveguides, metal oxide semiconductor field effect transistors (MOSFETs), and also the integration of Si-based monolithic photonics. The TDD of Ge epitaxial layer is analyzed by etching or transmission electron microscope (TEM). However, high-resolution x-ray diffraction (HR-XRD) rocking curve provides an optional method to analyze the TDD in Ge layer. The theory model of TDD measurement from rocking curves was first used in zinc-blende semiconductors. In this paper, this method is extended to the case of strained Ge-on-Si layers. The HR-XRD 2 theta/omega scan is measured and Ge (004) single crystal rocking curve is utilized to calculate the TDD in strained Ge epitaxial layer. The rocking curve full width at half maximum (FWHM) broadening by incident beam divergence of the instrument, crystal size, and curvature of the crystal specimen is subtracted. The TDDs of samples A and B are calculated to be 1.41 x 108 cm(-2) and 6.47 x 108 cm(-2), respectively. In addition, we believe the TDDs calculated by this method to be the averaged dislocation density in the Ge epitaxial layer.
引用
收藏
页数:5
相关论文
共 30 条
[1]   Room temperature direct band-gap emission from an unstrained Ge p-i-n LED on Si [J].
Arguirov, Tzanimir ;
Kittler, Martin ;
Oehme, Michael ;
Abrosimov, Nikolay V. ;
Kasper, Erich ;
Schulze, Joerg .
GETTERING AND DEFECT ENGINEERING IN SEMICONDUCTOR TECHNOLOGY XIV, 2011, 178-179 :25-+
[2]   Heteroepitaxial growth of high quality Germanium layer on Si(001) for GOI fabrication [J].
Bian, J. T. ;
Xue, Z. Y. ;
Chen, D. ;
Di, Z. F. ;
Zhang, M. .
SILICON COMPATIBLE MATERIALS, PROCESSES, AND TECHNOLOGIES FOR ADVANCED INTEGRATED CIRCUITS AND EMERGING APPLICATIONS 2, 2012, 45 (06) :195-201
[3]   Ultralow temperature ramping rate of LT to HT for the growth of highquality Ge epilayer on Si (100) by RPCVD [J].
Chen, Da ;
Xue, Zhongying ;
Wei, Xing ;
Wang, Gang ;
Ye, Lin ;
Zhang, Miao ;
Wang, Dewang ;
Liu, Su .
APPLIED SURFACE SCIENCE, 2014, 299 :1-5
[4]  
Cheng R, 2017, IEEE ELECTR DEVICE L, V1, P99
[5]   Low surface roughness and threading dislocation density Ge growth on Si (001) [J].
Choi, Donghun ;
Ge, Yangsi ;
Harris, James S. ;
Cagnon, Joel ;
Stemmer, Susanne .
JOURNAL OF CRYSTAL GROWTH, 2008, 310 (18) :4273-4279
[6]   THE ESTIMATION OF DISLOCATION DENSITIES IN METALS FROM X-RAY DATA [J].
GAY, P ;
HIRSCH, PB ;
KELLY, A .
ACTA METALLURGICA, 1953, 1 (03) :315-319
[7]   THE INTERPRETATION OF X-RAY ROCKING CURVES FROM III-V SEMICONDUCTOR-DEVICE STRUCTURES [J].
HALLIWELL, MAG ;
LYONS, MH ;
HILL, MJ .
JOURNAL OF CRYSTAL GROWTH, 1984, 68 (02) :523-531
[8]   Epitaxial growth of Ge thick layers on nominal and 6° off Si(001); Ge surface passivation by Si [J].
Hartmann, J. M. ;
Abbadie, A. ;
Cherkashin, N. ;
Grampeix, H. ;
Clavelier, L. .
SEMICONDUCTOR SCIENCE AND TECHNOLOGY, 2009, 24 (05)
[9]   Reduced pressure chemical vapor deposition of Ge thick layers on Si(001), Si(011) and Si(111) [J].
Hartmann, J. M. ;
Papon, A. M. ;
Destefaniz, V. ;
Billon, T. .
JOURNAL OF CRYSTAL GROWTH, 2008, 310 (24) :5287-5296
[10]   Investigation of the Low Temperature/High Temperature approach to produce Si0.5Ge0.5 and Ge Strain Relaxed Buffers [J].
Hartmann, J-M ;
Aubin, J. ;
Bogumilowicz, Y. ;
Delaye, V ;
Papon, A-M .
SIGE, GE, AND RELATED MATERIALS: MATERIALS, PROCESSING, AND DEVICES 7, 2016, 75 (08) :579-588