A newly designed paraffin@VO2 phase change material with the combination of high latent heat and large thermal conductivity

被引:48
作者
Cheng, Tianshu [1 ,2 ]
Wang, Ning [4 ]
Wang, Haixu [2 ,3 ]
Sun, Rong [1 ]
Wong, Ching-Ping [5 ]
机构
[1] Chinese Acad Sci, Shenzhen Inst Adv Technol, Shenzhen Inst Adv Elect Mat, Shenzhen 518055, Guangdong, Peoples R China
[2] Univ Sci & Technol China, Dept Nano Sci & Technol Inst, Shenzhen 215123, Guangdong, Peoples R China
[3] Shenzhen Univ, Coll Mat Sci & Engn, Shenzhen 518060, Guangdong, Peoples R China
[4] Sun Yat Sen Univ, Sch Chem Engn & Technol, Guangzhou 510275, Guangdong, Peoples R China
[5] Georgia Inst Technol, Sch Mat Sci & Engn, Atlanta, GA 30332 USA
基金
中国国家自然科学基金;
关键词
Paraffin wax; VO2; PCM; Solid-liquid/Solid-solid transition; Emulsion synthesis; Thermal management; PARAFFIN/EXPANDED GRAPHITE COMPOSITE; ENERGY-STORAGE; VANADIUM DIOXIDE; TRANSITION TEMPERATURE; THIN-FILMS; VO2; ENHANCEMENT; PROGRESS; SYSTEMS; PCM;
D O I
10.1016/j.jcis.2019.10.033
中图分类号
O64 [物理化学(理论化学)、化学物理学];
学科分类号
070304 ; 081704 ;
摘要
The paraffin is the widely used solid-liquid phase change material (PCM) with large fusion latent heat in thermal management, and vanadium dioxide (VO2) is a promising reversible solid-solid PCM with a near-ambient phase transition temperature (T-c = similar to 68 degrees C). In the real applications, the paraffin is always wrapped with inorganic or organic shells to stabilize the shape during the fusion/solidification with compromising large amounts of latent heat. Herein, we proposed the paraffin@VO2 PCM structure for the first time, which combines the solid-liquid paraffin PCM core and the solid-solid VO2 PCM shell. The paraffin@VO2 PCM structure is synthesized via an emulsion method starting with the Te/W-codoped VO2 microparticles and the paraffin wax (C26H54). This developed PCM structure shows a suitable T-c = 58.2 degrees C (Delta T-c = 5.5 degrees C), a decent fusion latent heat 163 J/g and a largely enhanced thermal conductivity 1.53 W/mK, which should be promising for the high-efficient thermal management applications. (C) 2019 Elsevier Inc. All rights reserved.
引用
收藏
页码:226 / 235
页数:10
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