Thermal Joints Based on Sintered Silver Micro- and Nano- Sized Particles

Downsizing and increase of working speed of the electronic circuits bring out generating of large amount of heat during operating. The thermal interface materials (TIMs) are one of the best choice to increase the efficiency of heat transfer from the heat source to the heat spreader. Moreover, micro- and nano- sized metallic compounds of thermal interface materials which aim is to increase the thermal conductivity combined with low temperature sintering process allows to create highly conductive (both, thermal and electrical), reliable mechanical joints. Within the paper the results of developing the thermal interface materials will be presented. The thermal resistance, electric parameters and mechanical strength measuring methods, the same as the structures analysis methods will be shown.