Effect of strain rate and temperature on the tensile properties of tin-based lead-free solder alloys

被引：21

作者：

Bai, Ning ^{[1
]}

Chen, Xu ^{[1
]}

Fang, Zhou ^{[1
]}

机构：

[1] Tianjin Univ, Sch Chem Engn & Technol, Tianjin 300072, Peoples R China

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2008年 / 37卷 / 07期

关键词：

lead-free solders; tensile properties; strain rate sensitivity; activation energy; elongation;

D O I：

10.1007/s11664-008-0445-0

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The tensile properties of Sn-3Ag-0.5Cu, Sn-3.5Ag, and Sn-0.7Cu lead-free solders were investigated on small-scale specimens and compared with those of Sn-37Pb eutectic solder at various strain rates from 1 x 10(-4) s(-1) to 1 x 10(-2) s(-1) and over a wide temperature range from 25 degrees C to 150 degrees C. The tests were under true strain-rate-controlled conditions. The ductility of each lead-free solder is relatively constant while that for Sn-Pb eutectic solder strongly depends on strain rate and temperature. The strain rate sensitivity index m for lead-free solders is relatively stable and showed little dependence on temperature, whereas the values of m for Sn-37Pb increased linearly with increasing temperature.

引用

页码：1012 / 1019

页数：8

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