Machine-vision-based measurement of BGA connector solder balls

被引：0

作者：

Jun, Gao ^{[1
]}

机构：

[1] Shanghai Inst Technol, Shanghai, Peoples R China

来源：

SNPD 2007: EIGHTH ACIS INTERNATIONAL CONFERENCE ON SOFTWARE ENGINEERING, ARTIFICIAL INTELLIGENCE, NETWORKING, AND PARALLEL/DISTRIBUTED COMPUTING, VOL 2, PROCEEDINGS | 2007年

关键词：

machine vision; solder ball measurement; measurement algorithm;

D O I：

10.1109/SNPD.2007.324

中图分类号：

TP18 [人工智能理论];

学科分类号：

081104 ; 0812 ; 0835 ; 1405 ;

摘要：

This article presents the principle and application of a machine-vision-based method of measuring the quality of solder balls on BGA devices. The method first acquires two images of a BGA connector respectively with the same light source but different light angles, obtains from the two images the information on surfaces of solder balls and calculates the chief quality parameters of the solder balls in the end. The main algorithm measuring the solder balls is given in the article.

引用

页码：177 / 180

页数：4