Opening and contact zones of an interface crack in a piezoelectric bimaterial under combined compressive-shear loading

被引:6
作者
Sheveleva, A. [1 ]
Lapusta, Y. [2 ]
Loboda, V. [1 ]
机构
[1] Dniepropetrovsk Natl Univ, Dept Theoret & Appl Mech, UA-49010 Dnepropetrovsk, Ukraine
[2] Clermont Univ, Inst Pascal, French Inst Adv Mech, UMR UBP CNRS IFMA 6602, F-63175 Aubiere, France
关键词
Interface crack; Compressive loading; Zones of crack opening; Piezoelectric bimaterial; FRACTURE-MECHANICS; MODELS;
D O I
10.1016/j.mechrescom.2014.11.003
中图分类号
O3 [力学];
学科分类号
08 ; 0801 ;
摘要
A plane problem for a tunnel electrically permeable interface crack between two semi-infinite piezoelectric spaces is studied. A remote mechanical and electrical loading is applied. Elastic displacements and potential jumps as well as stresses and electrical displacement along the interface are presented using a sectionally holomorphic vector function. It is assumed that the interface crack includes zones of crack opening and frictionless contact. The problem is reduced to a combined Dirichlet-Riemann boundary value problem which is solved analytically. From the obtained solution, simple analytical expressions are derived for all mechanical and electrical characteristics at the interface. A quite simple transcendental equation, which determines the point of separation of open and close sections of the crack, is found. For the analysis of the obtained results, the main attention is devoted to the case of compressive-shear loading. The analytical analysis and numerical results show that, even if the applied normal stress is compressive, a certain crack opening zone exists for all considered loading values provided the shear field is present. It is found that the shear stress intensity factor at the closed crack tip and the energy release rates at the both crack tips depend very slightly on the magnitude of compressive loading. (C) 2014 Elsevier Ltd. All rights reserved.
引用
收藏
页码:6 / 12
页数:7
相关论文
共 49 条
  • [41] Crack problem at interface of piezoelectric strip bonded to elastic layer under anti-plane shear
    Kwon, JH
    Lee, KY
    [J]. KSME INTERNATIONAL JOURNAL, 2001, 15 (01): : 61 - 65
  • [42] Crack problem at interface of piezoelectric strip bonded to elastic layer under anti-plane shear
    Jong Ho Kwon
    Kang Yong Lee
    [J]. KSME International Journal, 2001, 15 : 61 - 65
  • [43] Crack kinking out of interface of two orthotropic materials under combined thermal/mechanical loading
    Sevecek, Oldrich
    Kotoul, Michal
    Profant, Tomas
    Hrstka, Miroslav
    [J]. THEORETICAL AND APPLIED FRACTURE MECHANICS, 2020, 105 (105)
  • [44] Smooth interface crack between two bonded dissimilar orthotropic elastic media under shear loading
    Zhou, Sha-Xu
    Li, Xian-Fang
    [J]. EUROPEAN JOURNAL OF MECHANICS A-SOLIDS, 2020, 81
  • [45] An interface crack in a functionally graded piezoelectric bi-layer under anti-plane shear impact
    Jeong Woo Shin
    Young-Shin Lee
    Sung Joon Kim
    [J]. Acta Mechanica, 2013, 224 : 867 - 879
  • [46] The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading
    Yan-hong Cai
    Hao-ran Chen
    Li-qiang Tang
    Cheng Yan
    Wan Jiang
    [J]. Applied Mathematics and Mechanics, 2008, 29
  • [47] The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading
    Cai Yan-hong
    Chen Hao-ran
    Tang Li-qiang
    Yan Cheng
    Jiang Wan
    [J]. APPLIED MATHEMATICS AND MECHANICS-ENGLISH EDITION, 2008, 29 (11) : 1517 - 1526
  • [48] The dynamic stress intensity factor analysis of adhesively bonded material interface crack with damage under shear loading
    蔡艳红
    陈浩然
    唐立强
    闫澄
    江莞
    [J]. AppliedMathematicsandMechanics(EnglishEdition), 2008, (11) : 1517 - 1526
  • [49] Fracture mechanical assessment of interface cracks with contact zones in piezoelectric bimaterials under thermoelectromechanical loadings I. Electrically permeable interface cracks
    Herrmann, KP
    Loboda, VV
    [J]. INTERNATIONAL JOURNAL OF SOLIDS AND STRUCTURES, 2003, 40 (16) : 4191 - 4217