Thermal-mechanical coupling analysis for coupled power and thermal cycling reliability of chip-scale packages

被引：0

作者：

Lai, YS ^{[1
]}

Wang, TH ^{[1
]}

Lee, CC ^{[1
]}

机构：

[1] Adv Semicond Engn Inc, Stress Reliabil Lab, Kaohsiung, Taiwan

来源：

THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICRO-ELECTRONICS AND MICRO-SYSTEMS | 2005年

关键词：

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

The sequential thermal-mechanical coupling analysis, which solves in turn the transient temperature field and subsequent thermomechanical deformations, is carried out in this paper to investigate thermal characteristics along with fatigue reliability of board-level thin-profile fine-pitch ball grid array chip-scale packages under coupled power and thermal cycling test conditions. Pure thermal cycling and pure power cycling test conditions are also examined and compared.

引用

页码：539 / 544

页数：6

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