Effect of OFF-state stress induced electric field on trapping in AlGaN/GaN high electron mobility transistors on Si (111)

被引:20
作者
Anand, M. J. [1 ]
Ng, G. I. [1 ]
Arulkumaran, S. [2 ]
Kumar, C. M. Manoj [2 ]
Ranjan, K. [2 ]
Vicknesh, S. [2 ]
Foo, S. C. [2 ]
Syamal, B. [1 ]
Zhou, X. [1 ]
机构
[1] Nanyang Technol Univ, Sch Elect & Elect Engn, Singapore 639798, Singapore
[2] Nanyang Technol Univ, Temasek Labs NTU, Singapore 637553, Singapore
关键词
SURFACE-STATES; GAN; HEMTS; MECHANISM;
D O I
10.1063/1.4913841
中图分类号
O59 [应用物理学];
学科分类号
摘要
The influence of electric field (EF) on the dynamic ON-resistance (dyn-R-DS[ON]) and threshold-voltage shift (Delta Vth) of AlGaN/GaN high electron mobility transistors on Si has been investigated using pulsed current-voltage (I-DS-V-DS) and drain current (I-D) transients. Different EF was realized with devices of different gate-drain spacing (L-gd) under the same OFF-state stress. Under high-EF (L-gd = 2 mu m), the devices exhibited higher dyn-R-DS[ON] degradation but a small Delta Vth (similar to 120 mV). However, at low-EF (L-gd = 5 mu m), smaller dyn-R-DS[ON] degradation but a larger Delta Vth (similar to 380 mV) was observed. Our analysis shows that under OFF-state stress, the gate electrons are injected and trapped in the AlGaN barrier by tunnelling-assisted Poole-Frenkel conduction mechanism. Under high-EF, trapping spreads towards the gate-drain access region of the AlGaN barrier causing dyn-R-DS[ON] degradation, whereas under low-EF, trapping is mostly confined under the gate causing Delta Vth. A trap with activation energy 0.33 eV was identified in the AlGaN barrier by I-D-transient measurements. The influence of EF on trapping was also verified by Silvaco TCAD simulations. (C) 2015 AIP Publishing LLC.
引用
收藏
页数:4
相关论文
共 23 条
  • [1] Albahrani SA, 2009, 2009 EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, P1692
  • [2] Anand M. J., 2013, 71 ANN DEV RES C
  • [3] [Anonymous], 2009, ATLAS US MAN DEV SIM
  • [4] Demonstration of Submicron-Gate AlGaN/GaN High-Electron-Mobility Transistors on Silicon with Complementary Metal-Oxide-Semiconductor-Compatible Non-Gold Metal Stack
    Arulkumaran, Subramaniam
    Ng, Geok Ing
    Vicknesh, Sahmuganathan
    Wang, Hong
    Ang, Kian Siong
    Kumar, Chandramohan Manoj
    Teo, Khoon Leng
    Ranjan, Kumud
    [J]. APPLIED PHYSICS EXPRESS, 2013, 6 (01)
  • [5] Improved Power Device Figure-of-Merit (4.0 x 108 V2 Ω-1 cm-2) in AlGaN/GaN High-Electron-Mobility Transistors on High-Resistivity 4-in. Si
    Arulkumaran, Subramaniam
    Vicknesh, Sahmuganathan
    Ing, Ng Geok
    Selvaraj, Susai Lawrence
    Egawa, Takashi
    [J]. APPLIED PHYSICS EXPRESS, 2011, 4 (08)
  • [6] Astre G, 2010, EUR MICROW INTEGRAT, P298
  • [7] Trapping effects in GaN and SiC microwave FETs
    Binari, SC
    Klein, PB
    Kazior, TE
    [J]. PROCEEDINGS OF THE IEEE, 2002, 90 (06) : 1048 - 1058
  • [8] 1200-V Normally Off GaN-on-Si Field-Effect Transistors With Low Dynamic ON-Resistance
    Chu, Rongming
    Corrion, Andrea
    Chen, Mary
    Li, Ray
    Wong, Danny
    Zehnder, Daniel
    Hughes, Brian
    Boutros, Karim
    [J]. IEEE ELECTRON DEVICE LETTERS, 2011, 32 (05) : 632 - 634
  • [9] GaN HEMT reliability
    del Alamo, J. A.
    Joh, J.
    [J]. MICROELECTRONICS RELIABILITY, 2009, 49 (9-11) : 1200 - 1206
  • [10] Evidence of surface states for AlGaN/GaN/SiC HEMTs passivated Si3N4 by CDLTS
    Gassoumi, M.
    Grimbert, B.
    Gaquiere, C.
    Maaref, H.
    [J]. SEMICONDUCTORS, 2012, 46 (03) : 382 - 385