Analysis of high speed shear characteristics of Sn-Ag-Cu solder joints

被引：19

作者：

Kumar, Santosh ^{[1
]}

Park, Jae Yong ^{[2
]}

Jung, Jae Pil ^{[1
]}

机构：

[1] Univ Seoul, Dept Mat Sci & Engn, Seoul 130743, South Korea

[2] PDF Solut, Richardson, TX 75082 USA

来源：

ELECTRONIC MATERIALS LETTERS | 2011年 / 7卷 / 04期

关键词：

electronic materials; soldering; mechanical properties; scanning electron microscopy (SEM); high speed shear test; MECHANISM; RELIABILITY; FRACTURE;

D O I：

10.1007/s13391-011-0160-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A high speed shear test for Sn-Ag-Cu(3.0 wt %Sn and 0.5 wt % Ag) solder has been studied by varying shearing rate, tip height and solder volume. Failure mode analysis of the solder joint revealed that ductile and brittle failure modes coexist when the shearingspeed is 500 mm/s or higher. The higher the shearing rate, the fewer the ductile failures and the more brittle or mixed failures have been observed. Tip height variation does not have astrong impact on failure mode, but occasions for pad lift appeared to be strongly related with tip height conditions. While the maximum shear force does not provide any indication of the failure mechanism, careful analysis of the force-displacement curves showed the potential of area related indices as a method to analyze the various failure modes.

引用

页码：365 / 373

页数：9

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