Recent Advances in Thermal Interface Materials for Thermal Management of High-Power Electronics

被引：75

作者：

Xing, Wenkui ^{[1
,2
,3
]}

Xu, Yue ^{[1
,2
,3
]}

Song, Chengyi ^{[1
,2
,3
]}

Deng, Tao ^{[1
,2
,3
]}

机构：

[1] Shanghai Jiao Tong Univ, Sch Mat Sci & Engn, State Key Lab Met Matrix Composites, 800 Dong Chuan Rd, Shanghai 200240, Peoples R China

[2] Shanghai Jiao Tong Univ, Shanghai Key Lab Hydrogen Sci, Shanghai 200240, Peoples R China

[3] Shanghai Jiao Tong Univ, Ctr Hydrogen Sci, Shanghai 200240, Peoples R China

来源：

NANOMATERIALS | 2022年 / 12卷 / 19期

基金：

中国国家自然科学基金;

关键词：

thermal interface materials; thermal conductivity; high-power electronics; interfacial thermal resistance; thermal management; 3-DIMENSIONAL NETWORKS; CONTACT RESISTANCE; MATRIX COMPOSITES; CONDUCTIVITY; LIQUID; METAL; GRAPHENE; TEMPERATURE; TRANSPORT; MODEL;

D O I：

10.3390/nano12193365

中图分类号：

O6 [化学];

学科分类号：

0703 ;

摘要：

With the increased level of integration and miniaturization of modern electronics, high-power density electronics require efficient heat dissipation per unit area. To improve the heat dissipation capability of high-power electronic systems, advanced thermal interface materials (TIMs) with high thermal conductivity and low interfacial thermal resistance are urgently needed in the structural design of advanced electronics. Metal-, carbon- and polymer-based TIMs can reach high thermal conductivity and are promising for heat dissipation in high-power electronics. This review article introduces the heat dissipation models, classification, performances and fabrication methods of advanced TIMs, and provides a summary of the recent research status and developing trends of micro- and nanoscale TIMs used for heat dissipation in high-power electronics.

引用

页数：22

共 112 条

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