Transient characteristics of a two-phase thermosyphon loop for multichip module

被引：13
作者：
Nam, SS [1 ]
Choi, SB
Kim, JH
Kwak, HY
机构：
[1] Dankook Univ, Seoul, South Korea
[2] Elect & Telecommun Res Inst, HW Design Engn Team, ATM Switching Syst Dev Project, Taejon, South Korea
[3] Korea Aerosp Inst, Taejon, South Korea
[4] Daewoo Elect Co Ltd, Seoul, South Korea
[5] Chung Ang Univ, Fac Mech Engn, Coll Engn, Seoul, South Korea
来源：
ETRI JOURNAL | 1998年 / 20卷 / 03期
关键词：
D O I：
10.4218/etrij.98.0198.0303
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
A new thermosyphon cooling module (TSCM) has been designed, fabricated and tested to cool the multi-chip module plugged into a planar packaging system. The cooling module consists of a cold plate and an integrated condenser. With an allowable temperature rise of 56 degrees C on the surface of the heater, the cooling module TSCM can handle a heat flux of about 2.7 W/cm(2) using R11 as working fluid. The transient characteristics of the cooling module have been proved to be excellent: that is, when a heat load is applied inside of the system, steady state can be achieved within 10 to 15 minutes. It has been found that the length of the vapor channel between the cold plate and the condenser in addition to the ambient and the condenser temperatures affect the system performance.
引用
收藏
页码：284 / 300
页数：17
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