Suppression of stress-induced voiding in copper interconnects

被引：0

作者：

Oshima, T ^{[1
]}

Hinode, K ^{[1
]}

Yamaguchi, H ^{[1
]}

Aoki, H ^{[1
]}

Torii, K ^{[1
]}

Saito, T ^{[1
]}

Ishikawa, K ^{[1
]}

Noguchi, J ^{[1
]}

Fukui, M ^{[1
]}

Nakamura, T ^{[1
]}

Uno, S ^{[1
]}

Tsugane, K ^{[1
]}

Murata, J ^{[1
]}

Kikushima, K ^{[1
]}

Sekisaka, H ^{[1
]}

Murakami, E ^{[1
]}

Okuyama, K ^{[1
]}

Iwasaki, T ^{[1
]}

机构：

[1] Hitachi Ltd, Device Dev Ctr, Ome, Tokyo 1988512, Japan

来源：

INTERNATIONAL ELECTRON DEVICES 2002 MEETING, TECHNICAL DIGEST | 2002年

关键词：

D O I：

暂无

中图分类号：

TP3 [计算技术、计算机技术];

学科分类号：

0812 ;

摘要：

We studied stress-induced voiding in Cu interconnects in the temperature range below 250degrees C, and found two different voiding modes. One mode occurs inside a via having wide wire above it, and can be suppressed by optimizing the via shape and the via-cleaning process. The other mode occurs under a via having wide wire below it and can be suppressed by increasing the Cu grain size and improving the adhesion of the barrier metal with Cu.

引用

页码：757 / 760

页数：4

共 5 条

[1]

AOKI H, 2001, P IEDM, P76

[2]

ISHIKAWA K, 2001, PROGRA ADMETA, P59

[3] Stress-induced voiding under vias connected to wide Cu metal leads [J].

Ogawa, ET ;

McPherson, JW ;

Rosal, JA ;

Dickerson, KJ ;

Chiu, TC ;

Tsung, LY ;

Jain, MK ;

Bonifield, TD ;

Ondrusek, JC ;

McKee, WR .

40TH ANNUAL PROCEEDINGS: INTERNATIONAL RELIABILITY PHYSICS SYMPOSIUM, 2002, :312-321

[4] Improvement of thermal stability of via resistance in dual damascene copper interconnection [J].

Oshima, T ;

Tamaru, T ;

Ohmori, K ;

Aoki, H ;

Ashihara, H ;

Saito, T ;

Yamaguchi, H ;

Miyauchi, M ;

Torii, K ;

Murata, J ;

Satoh, A ;

Miyazaki, H ;

Hinode, K .

INTERNATIONAL ELECTRON DEVICES MEETING 2000, TECHNICAL DIGEST, 2000, :123-126

[5] Copper wires for high speed logic LSI prepared by low pressure long throw sputtering method [J].

Saito, T ;

Hashimoto, T ;

Ohashi, N ;

Fujiwara, T ;

Yamaguchi, H .

MATERIALS TRANSACTIONS, 2002, 43 (07) :1599-1604

← 1 →