Perspective: Ga2O3 for ultra-high power rectifiers and MOSFETS

被引:513
作者
Pearton, S. J. [1 ]
Ren, Fan [2 ]
Tadjer, Marko [3 ]
Kim, Jihyun [4 ]
机构
[1] Univ Florida, Dept Mat Sci & Engn, Gainesville, FL 32611 USA
[2] Univ Florida, Dept Chem Engn, Gainesville, FL 32611 USA
[3] US Naval Res Lab, Washington, DC 20375 USA
[4] Korea Univ, Dept Chem & Biol Engn, Seoul 02841, South Korea
关键词
BETA-GA2O3; SINGLE-CRYSTALS; FIELD-EFFECT TRANSISTORS; SCHOTTKY-BARRIER DIODES; P-I-N; BREAKDOWN VOLTAGE; ELECTRICAL CHARACTERIZATION; SEMICONDUCTOR-DEVICES; EPITAXIAL-GROWTH; EVENT BURNOUT; DENSITY;
D O I
10.1063/1.5062841
中图分类号
O59 [应用物理学];
学科分类号
摘要
Gallium oxide (Ga2O3) is emerging as a viable candidate for certain classes of power electronics with capabilities beyond existing technologies due to its large bandgap, controllable doping, and the availability of large diameter, relatively inexpensive substrates. These applications include power conditioning systems, including pulsed power for avionics and electric ships, solid-state drivers for heavy electric motors, and advanced power management and control electronics. Wide bandgap (WBG) power devices offer potential savings in both energy and cost. However, converters powered by WBG devices require innovation at all levels, entailing changes to system design, circuit architecture, qualification metrics, and even market models. The performance of high voltage rectifiers and enhancement-mode metal-oxide field effect transistors benefits from the larger critical electric field of beta-Ga2O3 relative to either SiC or GaN. Reverse breakdown voltages of over 2 kV for beta-Ga2O3 have been reported, either with or without edge termination and over 3 kV for a lateral field-plated Ga2O3 Schottky diode on sapphire. The metal-oxide-semiconductor field-effect transistors fabricated on Ga2O3 to date have predominantly been depletion (d-mode) devices, with a few demonstrations of enhancement (e-mode) operation. While these results are promising, what are the limitations of this technology and what needs to occur for it to play a role alongside the more mature SiC and GaN power device technologies? The low thermal conductivity might be mitigated by transferring devices to another substrate or thinning down the substrate and using a heatsink as well as top-side heat extraction. We give a perspective on the materials' properties and physics of transport, thermal conduction, doping capabilities, and device design that summarizes the current limitations and future areas of development. A key requirement is continued interest from military electronics development agencies. The history of the power electronics device field has shown that new technologies appear roughly every 10-12 years, with a cycle of performance evolution and optimization. The older technologies, however, survive long into the marketplace, for various reasons. Ga2O3 may supplement SiC and GaN, but is not expected to replace them. Published by AIP Publishing.
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页数:19
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