Solution-processed HafSOx and ZircSOx inorganic thin-film dielectrics and nanolaminates

被引:100
作者
Anderson, Jeremy T.
Munsee, Craig L.
Hung, Celia M.
Phung, Tran M.
Herman, Gregory S.
Johnson, David C.
Wager, John F.
Keszler, Douglas A.
机构
[1] Oregon State Univ, Dept Chem, Corvallis, OR 97331 USA
[2] Oregon State Univ, Sch Elect Engn & Comp Sci, Corvallis, OR 97331 USA
[3] Univ Oregon, Inst Mat Sci, Dept Chem, Eugene, OR 97403 USA
[4] Hewlett Packard Corp, Corvallis, OR 97330 USA
关键词
D O I
10.1002/adfm.200601135
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
New thin-film dielectrics and nanolaminates have been synthesized via aqueous-solution deposition of Hf and Zr sulfates, where facile gelation and vitrification of the precursor solution have been achieved without organic additives. X-ray reflectivity, imaging, and metal-insulator-metal capacitor performance reveal that smooth, atomically dense films are readily produced by spin coating and modest thermal treatment (T < 325 degrees C). Dielectric characteristics include permittivities covering the range of 9-12 with breakdown fields up to 6 MV cm(-1). Performance as gate dielectrics is demonstrated in field-effect transistors exhibiting small gate-leakage currents and qualitatively ideal device performance. The low-temperature processing, uniformity, and pore-free nature of the films have also allowed construction of unique, high-resolution nanolaminates exhibiting individual layers as thin as 3 nm.
引用
收藏
页码:2117 / 2124
页数:8
相关论文
共 45 条
  • [31] High-performance semiconducting polythiophenes for organic thin-film transistors
    Ong, BS
    Wu, YL
    Liu, P
    Gardner, S
    [J]. JOURNAL OF THE AMERICAN CHEMICAL SOCIETY, 2004, 126 (11) : 3378 - 3379
  • [32] Low-temperature thin-film deposition and crystallization
    Park, S
    Clark, BL
    Keszler, DA
    Bender, JP
    Wager, JF
    Reynolds, TA
    Herman, GS
    [J]. SCIENCE, 2002, 297 (5578) : 65 - 65
  • [33] Characterization of hafnium aluminate gate dielectrics deposited by liquid injection metalorganic chemical vapor deposition
    Potter, RJ
    Marshall, PA
    Chalker, PR
    Taylor, S
    Jones, AC
    Noakes, TCQ
    Bailey, P
    [J]. APPLIED PHYSICS LETTERS, 2004, 84 (20) : 4119 - 4121
  • [34] Pouchou JL., 1985, MICROBEAM ANAL, P104
  • [35] HfSiO4 dielectric layers deposited by ALD using HfCl4 and NH2(CH2)3Si(OC2H5)3 precursors
    Rittersma, ZM
    Roozeboom, F
    Verheijen, MA
    van Berkum, JGM
    Dao, T
    Snijders, JHM
    Vainonen-Ahlgren, E
    Tois, E
    Tuominen, M
    Haukka, S
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2004, 151 (11) : C716 - C722
  • [36] Effects of additive elements on improvement of the dielectric properties of Ta2O5 films formed by metalorganic decomposition
    Salam, KMA
    Fukuda, H
    Nomura, S
    [J]. JOURNAL OF APPLIED PHYSICS, 2003, 93 (02) : 1169 - 1175
  • [37] Solution-processed silicon films and transistors
    Shimoda, T
    Matsuki, Y
    Furusawa, M
    Aoki, T
    Yudasaka, I
    Tanaka, H
    Iwasawa, H
    Wang, DH
    Miyasaka, M
    Takeuchi, Y
    [J]. NATURE, 2006, 440 (7085) : 783 - 786
  • [38] CRYSTAL-STRUCTURE OF A COMPLEX BASIC ZIRCONIUM SULFATE
    SQUATTRITO, PJ
    RUDOLF, PR
    CLEARFIELD, A
    [J]. INORGANIC CHEMISTRY, 1987, 26 (25) : 4240 - 4244
  • [39] The influence of thermal treatment on the phase development in HfO2-Al2O3 and ZrO2-Al2O3 systems
    Stefanic, G
    Music, S
    Trojko, R
    [J]. JOURNAL OF ALLOYS AND COMPOUNDS, 2005, 388 (01) : 126 - 137
  • [40] Organic thin-film electronics from vitreous solution-processed rubrene hypereutectics
    Stingelin-Stutzmann, N
    Smits, E
    Wondergem, H
    Tanase, C
    Blom, P
    Smith, P
    De Leeuw, D
    [J]. NATURE MATERIALS, 2005, 4 (08) : 601 - 606