On-chip interconnection networks of the trips chip

被引:63
|
作者
Gratz, Paul [1 ]
Kim, Changkyu
Sankaralingam, Karthikeyan
Hanson, Heather
Shivakumar, Premkishore
Keckler, Stephen W.
Burger, Doug
机构
[1] Univ Texas, Dept Elect & Comp Engn, Austin, TX 78712 USA
[2] Univ Wisconsin, Madison, WI USA
关键词
Communication; Distributed architectures; Distributed processing; Interconnection networks; Multicore architectures; Networking; On-chip interconnection networks; Packet switching; Packet-switching networks;
D O I
10.1109/MM.2007.4378782
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
The trips chip prototypes two networks on chip to demonstrate the viability of a routed interconnection fabric for memory and operand traffic. In a 170million-transistor custom asic chip, these nocs provide system performance within 28 percent of ideal noncontended networks at a cost of 20 percent of the die area. Our experience shows that nocs are area-and complexity-efficient means of providing high-bandwidth, low-latency on-chip communication.
引用
收藏
页码:41 / 50
页数:10
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