Power electronics packaging and miniature using chip-scale packaged power devices

We present a power electronics packaging technology utilizing chip-scale packaged (CSP) power devices to build three-dimensional integrated power electronics modules (IPEMs). The chip-scale packaging structure, termed Die Dimensional Ball Grid Array (D(2)BGA), eliminates wire bonds by using stacked solder bumps to interconnect power chips. It has the same lateral dimensions as the starting power chip, which makes high-density packaging and module miniature possible. This package enables the power chip to combine excellent thermal transfer, high current handling capability, improved electrical characteristics, and ultra-low profile packaging. In this paper, we introduce the D2BGA power chip-scale package, and present the implementation of these chip-scale packaged power devices in building 30 kW half-bridge power converter modules. The electrical and reliability test results of the packaged devices and the power modules are reported.