Effects of microstructure on native oxide scale development and electrical characteristics of eutectic Cu-Cu6La alloys

被引:7
作者
Senturk, B. S. [1 ,2 ]
Liu, Y. [1 ,2 ]
Mantese, J. V. [3 ]
Alpay, S. P. [1 ,2 ]
Aindow, M. [1 ,2 ]
机构
[1] Univ Connecticut, Inst Mat Sci, Storrs, CT 06269 USA
[2] Univ Connecticut, Dept Chem Mat & Biomol Engn, Storrs, CT 06269 USA
[3] United Technol Res Ctr, E Hartford, CT 06108 USA
关键词
Copper alloys; Electrical resistivity/conductivity; Electron microscopy; Microstructure; Oxidation; CU2O THIN-FILMS; SYSTEM LA-CU; TERNARY-SYSTEM; COPPER; TEMPERATURE; OXIDATION; CONTACTS; GROWTH; BULK; AFM;
D O I
10.1016/j.actamat.2011.11.013
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
A combination of electron microscopy, focused ion beam and conductive atomic force microscopy techniques have been used to study the microstructure, oxide scale development, and electrical behavior of a Cu-9 at.% La alloy. The as-cast alloy exhibits a eutectic microstructure comprising 30 vol.% Cu rods in a Cu6La matrix. The eutectic colonies exhibit a singular orientation relationship with [0 1 0] Cu6La parallel to < 0 1 1 > Cu along the rod axis, and it is shown that this corresponds to lattice matching of the two phases along this direction (similar to 0.02% misfit). Oxidation of the alloy at 100 degrees C to accelerate formation of a native oxide scale led to the development of a Cu2O layer less than 25 nm thick on the Cu rods and a La-doped Cu2O scale up to I am thick on the Cu6La matrix. The La-doped regions of the scale are more conductive despite being much thicker, which is consistent with previous contact resistance data obtained for this alloy. The mechanisms responsible for the formation of this non-equilibrium oxide scale structure and for the enhanced electrical conductivity of the La-doped regions are discussed. (C) 2011 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
引用
收藏
页码:851 / 859
页数:9
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