Thermal Management in 3-D Integrated Circuits with Graphene Heat Spreaders

被引：25

作者：

Barua, A. ^{[1
]}

Hossain, Md S. ^{[1
]}

Masood, K. I. ^{[1
]}

Subrina, S. ^{[1
]}

机构：

[1] Bangladesh Univ Engn & Technol, Dept Elect & Elect Engn, Dhaka 1000, Bangladesh

来源：

INTERNATIONAL CONFERENCE ON SOLID STATE DEVICES AND MATERIALS SCIENCE | 2012年 / 25卷

关键词：

Graphene; Heat spreaders; Heat conduction; Thermal resistance; Thermal management; 3-D chip; PERFORMANCE;

D O I：

10.1016/j.phpro.2012.03.089

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

In this paper, we performed thermal analysis in three-dimensional (3-D) chip built on silicon-on insulator substrate. Since heat dissipation is one of the most serious issues in 3-D electronics, efficient thermal management is necessary for reliable and efficient circuit operation. 3-D finite element analysis was used to study the feasibility of the use of graphene in thermal management of 3-D integrated circuits. The simulation results showed that the incorporation of graphene heat spreaders lower the maximum temperature of the chip. We calculated the equivalent thermal resistance for different design schemes and found that larger thermal resistance cause higher temperature rise within the chip. The maximum temperature rise of the chip was studied as a function of dissipated power across the channels and interconnects and thermal conductivity of few-layer graphene. The simulation results are important for the thermal management of three-dimensional integrated circuits and next generation electronics. (C) 2012 Published by Elsevier B.V. Selection and/or peer-review under responsibility of Garry Lee

引用

页码：311 / 316

页数：6

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