Room-temperature pressureless bonding with silver nanowire paste: towards organic electronic and heat-sensitive functional devices packaging

被引：66

作者：

Peng, Peng ^{[1
,2
]}

Hu, Anming ^{[1
]}

Huang, Hong ^{[1
]}

Gerlich, Adrian P. ^{[1
]}

Zhao, Boxin ^{[2
,3
]}

Zhou, Y. Norman ^{[1
,2
]}

机构：

[1] Univ Waterloo, Ctr Adv Mat Joining, Dept Mech & Mechatron Engn, Waterloo, ON N2L 3G1, Canada

[2] Univ Waterloo, Waterloo Inst Nanotechnol, Waterloo, ON N2L 3G1, Canada

[3] Univ Waterloo, Dept Chem Engn, Waterloo, ON N2L 3G1, Canada

来源：

JOURNAL OF MATERIALS CHEMISTRY | 2012年 / 22卷 / 26期

基金：

加拿大自然科学与工程研究理事会;

关键词：

NANOPARTICLES; BEHAVIOR; SURFACE; PVP; UNIFORM; GROWTH; GOLD; SOFT;

D O I：

10.1039/c2jm31979a

中图分类号：

O64 [物理化学（理论化学）、化学物理学];

学科分类号：

070304 ; 081704 ;

摘要：

Heat-sensitive components packaging requires low temperature joining technology. The present study considers the feasibility of room-temperature pressureless joining of copper wires using silver nanowire paste. These joints achieve a tensile strength of 5.7 MPa and exhibit ultralow resistivity in the range of 101 n Omega m. An "in situ cleaning" action of PVP is proposed during the bonding process.

引用

页码：12997 / 13001

页数：5

共 51 条

[1] Silver Nanoparticle Paste for Low-Temperature Bonding of Copper [J].

Alarifi, Hani ;

Hu, Anming ;

Yavuz, Mustafa ;

Zhou, Y. Norman .

JOURNAL OF ELECTRONIC MATERIALS, 2011, 40 (06) :1394-1402

[2] Low-temperature sintered nanoscale silver as a novel semiconductor device-metallized substrate interconnect material [J].

Bai, John G. ;

Zhang, Zhiye Zach ;

Calata, Jesus N. ;

Lu, Guo-Quan .

IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2006, 29 (03) :589-593

[3] Investigation of Gold Nanoparticle Inks for Low-Temperature Lead-Free Packaging Technology [J].

Bakhishev, Teymur ;

Subramanian, Vivek .

JOURNAL OF ELECTRONIC MATERIALS, 2009, 38 (12) :2720-2725

[4] Large-scale growth and end-to-end assembly of silver nanorods by PVP-directed polyol process [J].

Chen, DL ;

Gao, L .

JOURNAL OF CRYSTAL GROWTH, 2004, 264 (1-3) :216-222

[5] Interfacial Reactions in Model NiTi Shape Memory Alloy Fiber-Reinforced Sn Matrix "Smart'' Composites [J].

Coughlin, J. P. ;

Williams, J. J. ;

Crawford, G. A. ;

Chawla, N. .

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 2009, 40A (01) :176-184

[6] Joining and Interconnect Formation of Nanowires and Carbon Nanotubes for Nanoelectronics and Nanosystems [J].

Cui, Qingzhou ;

Gao, Fan ;

Mukherjee, Subhadeep ;

Gu, Zhiyong .

SMALL, 2009, 5 (11) :1246-1257

[7]

Damjanovic D., 2006, The Science of Hysteresis, P337, DOI DOI 10.1016/B978-012480874-4/50022-1

[8] INTERMETALLIC GROWTH AND MECHANICAL-BEHAVIOR OF LOW AND HIGH-MELTING TEMPERATURE SOLDER ALLOYS [J].

FREAR, DR ;

VIANCO, PT .

METALLURGICAL AND MATERIALS TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE, 1994, 25 (07) :1509-1523

[9] Three-dimensional interconnected nanowire networks of ZnO [J].

Gao, PM ;

Lao, CS ;

Hughes, WL ;

Wang, ZL .

CHEMICAL PHYSICS LETTERS, 2005, 408 (1-3) :174-178

[10]

GLAZER J, 1995, INT MATER REV, V40, P65, DOI 10.1179/095066095790151115

← 1 2 3 4 5 6 →