Spectroscopic studies on electroless deposition of copper on hydrogen-terminated Si(III) surface in NH4F solution containing Cu(II) ions

被引:0
作者
Lee, IC [1 ]
Bae, SE [1 ]
Song, MB [1 ]
Lee, JS [1 ]
Paek, SH [1 ]
Lee, CWJ [1 ]
机构
[1] Korea Univ, Coll Sci & Technol, Jochiwon 339700, Choongnam, South Korea
关键词
silicon; copper; ammonium fluoride; ATR; STM;
D O I
暂无
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
The electroless deposition of copper on the hydrogen-terminated Si(111) surface was investigated by means of attenuated total reflection Fourier transform infrared (ATR-FTIR) spectroscopy, scanning tunneling microscopy (STM), and energy-dispersive spectroscopy (EDS). The hydrogen-terminated Si(111) surface prepared was stable under air atmosphere for a day or more. It was found from ATR-FTIR that two bands centered at 2000 and 2260 cm(-1) appeared after the H-Si(111) surface was immersed in 40% NH4F solution 21 containing 10 mM Cu2+. On the other hand, STM image included the copper islands with a height of 5 nm and a diameter of 10-20 nm. The EDS data displayed the presence of copper, silicon and oxygen species. The results were rationalized in terms of the redox reaction of surface Si atoms and Cu2+, ions in solutions, which are changed into Si(OH)(x)(F)(y) containing SiF62- ions and neutral copper islands.
引用
收藏
页码:167 / 171
页数:5
相关论文
共 17 条
[1]   Analysis of anodic oxidation current of flattened p-type Si(111) surface in aqueous solution [J].
Bensliman, F ;
Fukuda, A ;
Mizuta, N ;
Matsumura, M .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2003, 150 (09) :G527-G531
[2]  
CHELMA M, 2003, J ELECTROANAL CHEM, V559, P111
[3]  
GRAF D, 1989, J VAC SCI TECHNOL A, V7, P808, DOI 10.1116/1.575845
[4]   IDEAL HYDROGEN TERMINATION OF THE SI-(111) SURFACE [J].
HIGASHI, GS ;
CHABAL, YJ ;
TRUCKS, GW ;
RAGHAVACHARI, K .
APPLIED PHYSICS LETTERS, 1990, 56 (07) :656-658
[5]   SCALING LAW IN ULSI CONTAMINATION CONTROL [J].
HIRAIWA, A ;
ITOGA, T .
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1994, 7 (01) :60-67
[6]   Nucleation of trace copper on the H-Si(111) surface in aqueous fluoride solutions [J].
Homma, T ;
Wade, CP ;
Chidsey, CED .
JOURNAL OF PHYSICAL CHEMISTRY B, 1998, 102 (41) :7919-7923
[7]  
Lee HY, 1997, B KOR CHEM SOC, V18, P737
[8]   Masking effect of copper during anisotropic etching of silicon in buffered hydrofluoric acid solutions [J].
Li, GM ;
Jiao, J ;
Seraphin, S ;
Raghavan, S ;
Jeon, JS .
JOURNAL OF APPLIED PHYSICS, 1999, 85 (03) :1857-1863
[9]   MECHANISM OF METALLIC PARTICLE GROWTH AND METAL-INDUCED PITTING ON SI WAFER SURFACE IN WET CHEMICAL-PROCESSING [J].
MORINAGA, H ;
SUYAMA, M ;
OHMI, T .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1994, 141 (10) :2834-2841
[10]  
NEUWALD U, 1991, APPL PHYS LETT, V60, P1357