Electrochemical Fabrication of Copper and Tin Micro-Crystals from a Protic Ionic Liquid Medium

被引:5
作者
Bhujbal, Akshay Vilas [1 ]
Rout, Alok [2 ]
Venkatesan, Konda A. [2 ]
Bhanage, Bhalchandra M. [1 ]
机构
[1] Inst Chem Technol, Dept Chem, Mumbai 400019, Maharashtra, India
[2] Indira Gandhi Ctr Atom Res, Fuel Chem Div, Kalpakkam 603102, Tamil Nadu, India
关键词
Copper; Cyclic Voltammetry; Diffusion Coefficient; Electrodeposition; Ionic Liquid; Tin; PHYSICOCHEMICAL PROPERTIES; ACID-SULFATE; ELECTRODEPOSITION; ELECTROLYTES; LITHIUM; ALLOYS;
D O I
10.1002/slct.202000714
中图分类号
O6 [化学];
学科分类号
0703 ;
摘要
New protic ionic liquid, namely 1-Methylpiperidinium trifluoromethane sulphonate [HmPip][OTf] was synthesized and employed for the dissolution of Cu and Sn metal precursors followed by the electrodeposition process of the subsequent metals. The cyclic voltammogram of [HmPip][OTf], CuCl2 (80 mM) in [HmPip][OTf] and SnCl2 (65 mM) in [HmPip][OTf] phase recorded at glassy carbon electrode (working electrode), with the glassy carbon as counter and platinum as the reference electrode. The CV indicates that Cu2+ underwent two-step one-electron transfer, whereas Sn2+ reduced via one step two-electron transfer. The diffusion coefficient of Cu1+, Cu2+ and Sn2+ ions in [HmPip][OTf] phase were evaluated by the CV method. The experimental temperature and the scan rate were set at 353 K and 110 mV/s respectively. Electrodeposition of Cu and Sn was done at their corresponding reduction potential determined from cyclic voltammetry. Spectroscopic investigation of the deposits obtained after electrodeposition is done by SEM-EDX as well as XRD.
引用
收藏
页码:3694 / 3699
页数:6
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