Hot embossing of plastic microfluidic devices using poly(dimethylsiloxane) molds

被引：83
作者：
Goral, Vasiliy N. [1 ]
Hsieh, Yi-Cheng
Petzold, Odessa N. [1 ]
Faris, Ronald A. [1 ]
Yuen, Po Ki [1 ]
机构：
[1] Corning Inc, Sci & Technol, Corning, NY 14831 USA
来源：
JOURNAL OF MICROMECHANICS AND MICROENGINEERING | 2011年 / 21卷 / 01期
关键词：
D O I：
10.1088/0960-1317/21/1/017002
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
We present a poly(dimethylsiloxane) (PDMS)-based hot embossing process for low-cost rapid prototyping of plastic microfluidic devices. Unlike the conventional hot embossing process, the process presented here uses a 2 mm thick PDMS mold, two 3/4 '' wide binder clips, two standard 1 mm thick 1 '' x 3 '' microscope glass slides and a standard laboratory oven. Micro-scale features were successfully replicated in 1.5 mm thick polystyrene slides from various PDMS molds. Also, the PDMS molds can be reused for many replications without any damage.
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页数：8
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