Reduction of grain-boundary potential barrier height in polycrystalline silicon with hot H2O-vapor annealing probed using point-contact devices

被引:18
作者
Kamiya, T
Durrani, ZAK
Ahmed, H
Sameshima, T
Furuta, Y
Mizuta, H
Lloyd, N
机构
[1] Univ Cambridge, Hitachi Cambridge Lab, Microelect Res Ctr, Cambridge CB3 0HE, England
[2] Tokyo Univ Agr & Technol, Dept Elect & Elect Engn, Tokyo 1848588, Japan
[3] Univ Southampton, Dept Elect & Comp Sci, Ctr Microelect, Southampton SO17 1BJ, Hants, England
来源
JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 2003年 / 21卷 / 03期
关键词
D O I
10.1116/1.1570849
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The effects of hot H2O-vapor annealing were investigated on local carrier transport properties over a few grain boundaries in polycrystalline silicon. It shows that hot H2O-vapor annealing effectively reduces grain-boundary dangling bonds and the potential barrier height. In addition, it narrows the distribution of the barrier height value significantly. These effects are thought to originate from oxidation in the vicinity of the film surface, and from hydrogenation in the deeper region. Our results suggest that H2O annealing can improve the carrier transport properties by opening up shorter percolation paths and by increasing the effective carrier mobility and density. (C) 2003 American Vacuum Society.
引用
收藏
页码:1000 / 1003
页数:4
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