Throughput Characterization for Bluetooth Low Energy with Applications in Body Area Networks

被引：0

作者：

Ayoub, Michael A. ^{[2
]}

Eltawil, Ahmed M. ^{[1
]}

机构：

[1] King Abdullah Univ Sci & Technol, Thuwal, Saudi Arabia

[2] Univ Calif Irvine, Irvine, CA 92697 USA

来源：

2020 IEEE INTERNATIONAL SYMPOSIUM ON CIRCUITS AND SYSTEMS (ISCAS) | 2020年

关键词：

Bluetooth Low Energy; Body Area Networks; Electrocardiography; Internet of Things; Medical Wearables;

D O I：

暂无

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Bluetooth Low Energy (BLE) has emerged as a technology of choice in many applications including body area networks (BAN). In this paper, we investigate the use of BLE in terms of throughput, power consumption and latency and evaluate its suitability for BAN applications. We compare the performance of different versions of the Bluetooth core specification using a theoretical model and an experimental setup based on nRF52840 chip by Nordic Semiconductor. We focus on Electrocardiography (EKG) and give the current consumption and battery lifetime estimation of an EKG BLE node for different BLE versions and configurations.

引用

页数：4

共 14 条

[1] Bing Zhou, 2013, 2013 IEEE 15th International Conference on e-Health Networking, Applications and Services (Healthcom 2013), P130, DOI 10.1109/HealthCom.2013.6720653
[2] Bluetooth SIG, 2016, COR SPEC V50
[3] Censi F., 2012, PHYS MEAS, V33
[4] Gertsch M, 2009, ECG MANUAL EVIDANCE
[5] Giovanelli D, 2015, 2015 6TH IEEE INTERNATIONAL WORKSHOP ON ADVANCES IN SENSORS AND INTERFACES (IWASI), P216, DOI 10.1109/IWASI.2015.7184945
[6] Overview and Evaluation of Bluetooth Low Energy: An Emerging Low-Power Wireless Technology
Gomez, Carles
Oller, Joaquim
Paradells, Josep
[J]. SENSORS, 2012, 12 (09): : 11734 - 11753
[7] Modeling the Maximum Throughput of Bluetooth Low Energy in an Error-Prone Link
Gomez, Carles
Demirkol, Ilker
Paradells, Josep
[J]. IEEE COMMUNICATIONS LETTERS, 2011, 15 (11) : 1187 - 1189
[8] Nordic Semiconductor, 2016, ONL POW PROF
[9] Nordic Semiconductor, 2018, S140 SOFTDEVICE SPEC
[10] Nordic Semiconductor, 2018, NRF52840 PROD SPEC V, P54

← 1 2 →