In-Situ Monitoring on Junction Temperature for Degradation Analysis of Light Emitting Diodes

被引:0
作者
Ma, Byungjin [1 ]
Choi, Sungsoon [1 ]
Lee, Kwan Hun [1 ]
机构
[1] Korea Elect Technol Inst, Seongnam Si, Gyeonggi Do, South Africa
来源
2015 21ST INTERNATIONAL WORKSHOP ON THERMAL INVESTIGATIONS OF ICS AND SYSTEMS (THERMINIC) | 2015年
关键词
RELIABILITY;
D O I
暂无
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
A precise monitoring on the junction temperature of the light-emitting diode (LED) packages during a lifetime tests is very helpful to make a diagnosis of their quality change and to analyse the optical degradation. We proposed a new model for internal quantum efficiency (IQE) of the LED packages as a function of the junction temperature and developed an in-situ IQE measurement system for an investigation of the optical degradation mechanism in the LED packages. A lifetime test for 2,500 hours had been carried out with in-situ monitoring on the relative optical power and the sub-threshold leakage current. In addition, we had measured the junction temperature and the IQE as a tool for the degradation analysis of the LED packages. No change in the IQE and the leakage current throughout the lifetime test has been observed although there was a 10% optical degradation of the LED package.
引用
收藏
页数:4
相关论文
共 50 条
[41]   Optical Degradation of Phosphor-Converted White GaN-Based Light-Emitting Diodes under Electro-Thermal Stress [J].
Jung, Eunjin ;
Ryu, Jae Hyoung ;
Hong, Chang Hee ;
Kim, Hyunsoo .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 2011, 158 (02) :H132-H136
[42]   Analysis of Deep-Trap States in GaN/InGaN Ultraviolet Light-Emitting Diodes after Electrical Stress [J].
Seonghoon Jeong ;
Hyunsoo Kim ;
Sung-Nam Lee .
Journal of the Korean Physical Society, 2018, 73 :1879-1883
[43]   Analysis of Deep-Trap States in GaN/InGaN Ultraviolet Light-Emitting Diodes after Electrical Stress [J].
Jeong, Seonghoon ;
Kim, Hyunsoo ;
Lee, Sung-Nam .
JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 2018, 73 (12) :1879-1883
[44]   Strain and Deformation of Flip Chip with Underfill at High Temperature: In-situ Characterization and Finite Element Analysis [J].
Zhang, Zhen'an ;
Zhong, Cheng ;
Peng, Xu ;
Li, Gang ;
Lu, Jibao ;
Sun, Rong ;
Peng, Liang ;
Zhu, Pengli .
2022 23RD INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2022,
[45]   High Temperature Performance Evaluation and Life Prediction for Titanium Modified Silicone Used in Light-Emitting Diodes Chip Scale Packages [J].
Yu Si ;
Wang Zhen ;
Fan Jiajie ;
Qian Cheng ;
Deng Zhentao ;
Gui Dayong .
JOURNAL OF ELECTRONIC PACKAGING, 2020, 142 (02)
[46]   Rapid Optical Degradation of GaN-Based Light-Emitting Diodes by a Current-Crowding-Induced Self-Accelerating Thermal Process [J].
Jung, Eunjin ;
Kim, Hyunsoo .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2014, 61 (03) :825-830
[47]   Operation-induced degradation mechanisms of 275-nm-band AlGaN-based deep-ultraviolet light-emitting diodes fabricated on a sapphire substrate [J].
Chichibu, S. F. ;
Nagata, K. ;
Oya, M. ;
Kasuya, T. ;
Okuno, K. ;
Ishiguro, H. ;
Saito, Y. ;
Takeuchi, T. ;
Shima, K. .
APPLIED PHYSICS LETTERS, 2023, 122 (20)
[48]   Generating temperature cycle profile from in-situ climatic condition for accurate prediction of thermo-mechanical degradation of c-Si photovoltaic module [J].
Nyarko, Frank K. A. ;
Takyi, G. ;
Amalu, Emeka H. ;
Adaramola, Muyiwa S. .
ENGINEERING SCIENCE AND TECHNOLOGY-AN INTERNATIONAL JOURNAL-JESTECH, 2019, 22 (02) :502-514
[49]   In Situ Insulated Gate Bipolar Transistor Junction Temperature Estimation Method via a Bond Wire Degradation Independent Parameter Turn-OFF Vce Overshoot [J].
Yang, Yanyong ;
Zhang, Pinjia .
IEEE TRANSACTIONS ON INDUSTRIAL ELECTRONICS, 2021, 68 (10) :10118-10129
[50]   High-Stability Quantum Dot-Converted 3-in-1 Full-Color Mini-Light-Emitting Diodes Passivated With Low-Temperature Atomic Layer Deposition [J].
Huang, Yu-Ming ;
Ahmed, Tanveer ;
Liu, An-Chen ;
Chen, Sung-Wen Huang ;
Liang, Kai-Ling ;
Liou, Yu-Hau ;
Ting, Chao-Cheng ;
Kuo, Wei-Hung ;
Fang, Yen-Hsiang ;
Lin, Chien-Chung ;
Kuo, Hao-Chung .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 2021, 68 (02) :597-601