Preparation of ultrasmooth and defect-free 4H-SiC(0001) surfaces by elastic emission machining

被引：22

作者：

Kubota, A

Mimura, H

Inagaki, K

Arima, K

Mori, Y

Yamauchi, K

机构：

[1] Osaka Univ, Grad Sch Engn, Dept Precis Sci & Technol, Suita, Osaka 5650871, Japan

[2] Osaka Univ, Grad Sch Engn, Res Ctr Ultraprec Sci & Technol, Osaka, Japan

来源：

JOURNAL OF ELECTRONIC MATERIALS | 2005年 / 34卷 / 04期

关键词：

elastic emission machining (EEM); silicon carbide; surface morphology; atomic force microscopy (AFM); low-energy electron diffraction (LEED);

D O I：

10.1007/s11664-005-0124-3

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work, elastic emission machining (EEM), which is a precise surfacepreparation technique using chemical reactions between the surfaces of work and fine powder particles, is applied to the flattening 4H-SiC (0001) surface. Prepared surfaces are observed and characterized by optical interferometry, atomic force microscopy (AFM), and low-energy electron diffraction (LEED). The obtained images show that the processed surface has atomic-level flatness, and the subsurface damage and surface scratches of the preprocessed surface are almost entirely removed.

引用

页码：439 / 443

页数：5

共 14 条

[1] MECHANOCHEMICAL POLISHING OF SILICON-CARBIDE SINGLE-CRYSTAL WITH CHROMIUM(III) OXIDE ABRASIVE [J].

KIKUCHI, M ;

TAKAHASHI, Y ;

SUGA, T ;

SUZUKI, S ;

BANDO, Y .

JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1992, 75 (01) :189-194

[2] Electro-chemical mechanical polishing of silicon carbide [J].

Li, CH ;

Bhat, IB ;

Wang, RJ ;

Seiler, J .

JOURNAL OF ELECTRONIC MATERIALS, 2004, 33 (05) :481-486

[3] Image quality improvement in a hard X-ray projection microscope using total reflection mirror optics [J].

Mimura, H ;

Yamauchi, K ;

Yamamura, K ;

Kubota, A ;

Matsuyama, S ;

Sano, Y ;

Ueno, K ;

Endo, K ;

Nishino, Y ;

Tamasaku, K ;

Yabashi, M ;

Ishikawa, T ;

Mori, Y .

JOURNAL OF SYNCHROTRON RADIATION, 2004, 11 :343-346

[4] ELASTIC EMISSION MACHINING [J].

MORI, Y ;

YAMAUCHI, K ;

ENDO, K .

PRECISION ENGINEERING-JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1987, 9 (03) :123-128

[5] EVALUATION OF ELASTIC EMISSION MACHINED SURFACES BY SCANNING TUNNELING MICROSCOPY [J].

MORI, Y ;

YAMAUCHI, K ;

ENDO, K ;

IDE, T ;

TOYOTA, H ;

NISHIZAWA, K ;

HASEGAWA, M .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1990, 8 (01) :621-624

[6] Development of plasma chemical vaporization machining and elastic emission machining systems for coherent x-ray optics [J].

Mori, Y ;

Yamauchi, K ;

Yamamura, K ;

Mimura, H ;

Saito, A ;

Kishimoto, H ;

Sekito, Y ;

Kanaoka, M .

X-RAY MIRRORS, CRYSTALS AND MULTILAYERS, 2001, 4501 :30-42

[7] MECHANISM OF ATOMIC REMOVAL IN ELASTIC EMISSION MACHINING [J].

MORI, Y ;

YAMAUCHI, K ;

ENDO, K .

PRECISION ENGINEERING-JOURNAL OF THE AMERICAN SOCIETY FOR PRECISION ENGINEERING, 1988, 10 (01) :24-28

[8] Removal of polishing-induced damage from 6H-SiC(0001) substrates by hydrogen etching [J].

Owman, F ;

Hallin, C ;

Martensson, P ;

Janzen, E .

JOURNAL OF CRYSTAL GROWTH, 1996, 167 (1-2) :391-395

[9] Preparation of atomically flat surfaces on silicon carbide using hydrogen etching [J].

Ramachandran, V ;

Brady, MF ;

Smith, AR ;

Feenstra, RM ;

Greve, DW .

JOURNAL OF ELECTRONIC MATERIALS, 1998, 27 (04) :308-312

[10] Two-dimensional submicron focusing of hard X-rays by two elliptical mirrors fabricated by plasma chemical vaporization machining and elastic emission machining [J].

Yamauchi, K ;

Yamamura, K ;

Mimura, H ;

Sano, Y ;

Saito, A ;

Endo, K ;

Souvorov, A ;

Yabashi, M ;

Tamasaku, K ;

Ishikawa, T ;

Mori, Y .

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS BRIEF COMMUNICATIONS & REVIEW PAPERS, 2003, 42 (11) :7129-7134

← 1 2 →