A thermal resistance network model based on three-dimensional structure

被引：17

作者：

Han, Lei ^{[1
]}

Tong, Zhenyang ^{[1
]}

机构：

[1] Southeast Univ, Key Lab MEMS, Minist Educ, Nanjing 210096, Jiangsu, Peoples R China

来源：

MEASUREMENT | 2019年 / 133卷

基金：

中国国家自然科学基金;

关键词：

Thermal resistance network model; Three dimension; Iterative algorithm; Thermal distribution; CIRCUITS;

D O I：

10.1016/j.measurement.2018.10.053

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

A thermal resistance network model based on three-dimensional structure is proposed in this paper. In a chip package newly developed method (three-dimensional stacked package), the thermal distribution management is essential. In order to improve the thermal design of a chip package structure, a thermal resistance network model of temperature distribution is established based on the thermal resistance network and the principle of spherical wall heat conduction. The principle of spherical wall heat conduction is adopted to calculate the complete 3-D temperature distribution at arbitrary position. For the analysis of the thermal resistance of thermal convection, the convection coefficient is calculated based on iterative algorithm. When the heating power arises from 0.27 W to 2.18 W, the errors between the calculation results and the experimental results are less than 5%. The experimental results validate the calculation results well. (C) 2018 Elsevier Ltd. All rights reserved.

引用

页码：439 / 443

页数：5

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