Study on vibration analysis for printed circuit board of an electronic apparatus

被引：5
作者：
Tang, Weibin [1 ]
Ren, Jianfeng [2 ]
Feng, Gangying [2 ]
Xu, Limei [1 ]
机构：
[1] Univ Elect Sci & Technol China, Inst Aeronaut & Astronaut, Chengdu 610054, Sichuan, Peoples R China
[2] Inst Southeast Elect Technol, Chengdu 610061, Sichuan, Peoples R China
来源：
2007 IEEE INTERNATIONAL CONFERENCE ON MECHATRONICS AND AUTOMATION, VOLS I-V, CONFERENCE PROCEEDINGS | 2007年
关键词：
modal Analysis; electronic apparatus module; PCB; electromotive test;
D O I：
10.1109/ICMA.2007.4303657
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
The estimation of the mechanical reliability of the printed circuit board (PCB) in electronic apparatus was considered to be an important part of the overall reliability estimate. The vibration often plays the key cause of invalidation. This paper addresses basic modeling issues and choice of four modes of boundary condition to simulate the solder joints on the PCB. The PCB is composed of laminated copper and FR-4 glass epoxy. Finite element modelling of an electronic apparatus module is used to estimate the modal characteristics. Large components populated on the PCB, such as a crystal oscillator and some integrated circuit blocks, are modeled as simple homogenous, rectangular blocks or cylinders. The elastic modulus for these components is determined by a designed experimental test. The mode shapes and natural frequencies of the PCB are computed and correlated with measurement by a vibration experiment. The simulated results show a good correlation with measured values. It is proved to be the potential mean to predict vibration reliability estimation of the studied object in advance.
引用
收藏
页码：855 / +
页数：2
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