Long-Term Reliability of Solder Joints in 3D ICs under Near-Application Conditions

被引：0

作者：

Ahmed, Omar ^{[1
,2
]}

Jalilvand, Golareh ^{[1
,2
]}

Fernandez, Hector ^{[1
,2
]}

Su, Peng ^{[3
]}

Lee, Tae-Kyu ^{[4
]}

Jiang, Tengfei ^{[1
,2
]}

机构：

[1] Univ Cent Florida, Dept Mat Sci & Engn, Orlando, FL 32816 USA

[2] Univ Cent Florida, Adv Mat Proc & Anal Ctr, Orlando, FL 32816 USA

[3] Juniper Networks, Component Engn, Sunnyvale, CA 94089 USA

[4] Portland State Univ, Dept Mech & Mat Engn, Portland, OR 97201 USA

来源：

2019 IEEE 69TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC) | 2019年

关键词：

3D integration; Intermetallic compounds; Solder bumps; Micro-bumps; Reliability; Lead free solder; INTERFACIAL REACTION; CU;

D O I：

10.1109/ECTC.2019.00172

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

In this work, the long-term reliability of solder joints in 3D memory ICs (Integrated Circuits) was investigated. Three types of acceleration tests were carried out, where the temperature-time profiles were chosen to reflect near-operation conditions. For components after 500, 1000, and 1500 hours of testing, the formation and growth of intermetallic compounds (IMCs) in C4 bumps was inspected and analyzed using characterization techniques including scanning electron microscopy (SEM), energy dispersive x-ray spectroscopy (EDS), and Electron Backscatter Diffraction (EBSD). Different IMC growth behaviors were observed among the three different test conditions and discussed. The different behaviors between C4 bumps and mu-bumps were also evaluated, which can be traced to differences in the solder volume and the IMC/solder ratio between these two structures.

引用

页码：1106 / 1112

页数：7

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