Annealing characteristics of nanostructured cu-fe-p alloy processed by accumulative roll-bonding

被引：16
作者：
Lee, Seong-Hee [1 ]
Lee, Chung-Hyo
Yoon, Suk-Ja
Han, Seung-Zeon
Lim, Cha-Yong
机构：
[1] Mokpo Natl Univ, Dept Adv Mat Sci & Engn, Choongnam 534729, South Korea
[2] Chonnam Natl Univ, Sch Dent, Dept Oral & Maxillofacial Radiol, Kwangju 501190, South Korea
[3] Korea Inst Machinery & Mat, Dept Mat Technol, Chang Won 641010, South Korea
来源：
JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY | 2007年 / 7卷 / 11期
关键词：
nano-grained structure; cu-fe-p alloy; annealing; transmission electron; Microscopy; mechanical property;
D O I：
10.1166/jnn.2007.050
中图分类号：
O6 [化学];
学科分类号：
0703 ;
摘要：
Annealing characteristics of a nanostructured copper alloy processed by accumulative roll-bonding (ARB) were studied. A nano-grained Cu-Fe-P alloy processed by 8 cycles of the ARB was annealed at various temperatures ranging from 100 to 400 degrees C for 0.6 ks. The sample still showed an ultrafine grained (UFG) structure up to 250 degrees C, however above 300 degrees C it began to replace by equiaxed and coarse grains due to an occurrence of the conventional static recrystallization. The hardness of the annealed copper decreased largely above 300 degrees C. These annealing characteristics of the UFG copper alloy were compared to those of a high purity copper.
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收藏
页码：3872 / 3875
页数：4
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