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- [1] Optimization of PCB Transitions for Vertical Solderless Coaxial Connectors up to 67 GHz 2018 48TH EUROPEAN MICROWAVE CONFERENCE (EUMC), 2018, : 1273 - 1276
- [2] Solderless Coax-to-Microstrip Connector up to 67 GHz Using Capsule Clearance Transition and Neural Network Optimization IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2024, 14 (01): : 81 - 88
- [3] Measurement of PCB Surface Finishes for Substrate Characterization up to 67 GHz 2018 IEEE ANTENNAS AND PROPAGATION SOCIETY INTERNATIONAL SYMPOSIUM ON ANTENNAS AND PROPAGATION & USNC/URSI NATIONAL RADIO SCIENCE MEETING, 2018, : 1059 - 1060
- [4] Broadband Measurement of Dielectric Properties of Substrates up to 67 GHz using a Coaxial Air Line PROCEEDINGS OF THE 2020 IEEE/MTT-S INTERNATIONAL MICROWAVE SYMPOSIUM (IMS), 2020, : 361 - 364
- [5] High performances of shielded LTCC vertical transitions from DC up to 50 GHz 34TH EUROPEAN MICROWAVE CONFERENCE, VOLS 1-3, CONFERENCE PROCEEDINGS, 2004, : 537 - 539
- [8] A Study of Connectors and Feed Lines De-Embedding Techniques for PCB Microwave Components S-Parameters Measurements Up To 50 Ghz 2020 DYNAMICS OF SYSTEMS, MECHANISMS AND MACHINES (DYNAMICS), 2020,
- [9] Optimized wire-bond transitions for microwave applications up to 67 GHz using the low loss LTCC material DuPont 9k7 2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC), 2013,