Combining thermography and stress analysis for tensile testing in a single sensor

We combine image correlation and thermography to measure the two-dimensional strain field along with the temperature distribution of a specimen in a tensile testing machine. Both methods have been combined before, yet they usually rely on different imaging devices, requiring the strain and temperature data to be aligned and parallax-corrected in post-processing. In our novel approach, we perform the image correlation directly on the thermography data - thus reducing the complexity of the measurement setup significantly. We demonstrate the method by quantifying the stress-strain-temperature relation of localized deformation bands in aluminum.