The Effect of Wetting Gravity Regime on Shear Strength of SAC and Sn-Pb Solder Lap Joints

被引：4

作者：

Sona, Mrunali ^{[1
]}

Prabhu, K. Narayan ^{[1
]}

机构：

[1] Natl Inst Technol Karnataka, Dept Met & Mat Engn, Mangalore 575025, India

来源：

JOURNAL OF MATERIALS ENGINEERING AND PERFORMANCE | 2017年 / 26卷 / 09期

关键词：

lead-free solders; single-lap shear test; ultimate shear strength; wetting gravity regime; LEAD-FREE SOLDERS; MECHANICAL-PROPERTIES;

D O I：

10.1007/s11665-017-2857-6

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

The failure of solder joints due to imposed stresses in an electronic assembly is governed by shear bond strength. In the present study, the effect of wetting gravity regime on single-lap shear strength of Sn-0.3Ag-0.7Cu and Sn-2.5Ag-0.5Cu solder alloys reflowed between bare copper substrates as well as Ni-coated Cu substrates was investigated. Samples were reflowed for 10 s, T (gz) (time corresponding to the end of gravity regime) and 100 s individually and tested for single-lap shear strength. The single-lap shear test was also carried out on eutectic Sn-Pb/Cu- and Sn-Pb/Ni-coated Cu specimens to compare the shear strength values obtained with those of lead-free alloys. The eutectic Sn-Pb showed significantly higher ultimate shear strength on bare Cu substrates when compared to Sn-Ag-Cu alloys. However, SAC alloys reflowed on nickel-coated copper substrate exhibited higher shear strength when compared to eutectic Sn-Pb/Ni-coated Cu specimens. All the substrate/solder/substrate lap joint specimens that were reflowed for the time corresponding to the end of gravity regime exhibited maximum ultimate shear strength.

引用

页码：4177 / 4187

页数：11

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