An Extended XY Coil for Noise Reduction in Inductive-Coupling Link

被引：11
作者：
Saito, Mitsuko [1 ]
Kasuga, Kazutaka [1 ]
Takeya, Tsutomu [1 ]
Miura, Noriyuki [1 ]
Kuroda, Tadahiro [1 ]
机构：
[1] Keio Univ, Dept Elect & Elect Engn, Yokohama, Kanagawa 223, Japan
来源：
2009 IEEE ASIAN SOLID-STATE CIRCUITS CONFERENCE (A-SSCC) | 2009年
关键词：
D O I：
10.1109/ASSCC.2009.5357248
中图分类号：
TM [电工技术]; TN [电子技术、通信技术];
学科分类号：
0808 ; 0809 ;
摘要：
Inductive-coupling link between stacked chips in a package communicates by using coils made by on-chip interconnections. An XY-coil layout style allows logic interconnections to go through the coil, which significantly saves interconnection resources consumed by the coil. However, the logic interconnections generate capacitive-coupling noise on the coil and degrade signal in the inductive-coupling link. In this paper, an extended XY coil with ground shields is presented for noise reduction. Simulation study shows that the noise voltage is reduced to 1/5 of the conventional XY coil. This noise reduction enables to reduce transmit power required for the same BER. Test-chip measurement in 0.18 mu m CMOS demonstrates that the transmit power at 1Gb/s with BER<10(-12) is reduced by 60% compared to the conventional XY coil.
引用
收藏
页码：305 / 308
页数：4
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