Automatic Layout Optimization of a Double Sided Power Module Regarding Thermal and EMC constraints

被引：0

作者：

Mandray, Sylvain ^{[1
]}

Guichon, Jean-Michel ^{[1
]}

Schanen, Jean-Luc ^{[1
]}

Vieillard, Sebastien ^{[2
]}

Bouzourene, Arezki ^{[3
]}

机构：

[1] Grenoble Elect Engn Lab, Bat Ense3,BP 46, F-38402 St Martin Dheres, France

[2] Hispano Suiza, Div Elect Rond Point Rene, Grp SAFRAN, F-75571 Paris, France

[3] THALES, F-78401 Chatou, France

来源：

2009 IEEE ENERGY CONVERSION CONGRESS AND EXPOSITION, VOLS 1-6 | 2009年

关键词：

Electromagnetic compatibility; Electrothermal effects; Power Electronics; Printed circuit layout; Semiconductor device packaging;

D O I：

暂无

中图分类号：

TE [石油、天然气工业]; TK [能源与动力工程];

学科分类号：

0807 ; 0820 ;

摘要：

This paper presents an automatic layout process for power electronics integrated modules. The chip position and power layout is automatically generated according to the best EMC/Thermal trade off. Optimization techniques use simple but fairly accurate EMC and Thermal models, presented in this paper. The proposed method is illustrated on a 4 legs 2kW inverter used for aircraft applications. The realization will use double sided technology.

引用

页码：547 / +

页数：2

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