Parametric dependence of fatigue of electronic adhesives

被引：6

作者：

Gladkov, A ^{[1
]}

Bar-Cohen, A ^{[1
]}

机构：

[1] Univ Minnesota, Dept Mech Engn, Minneapolis, MN 55455 USA

来源：

3RD INTERNATIONAL CONFERENCE ON ADHESIVE JOINING AND COATING TECHNOLOGY IN ELECTRONICS MANUFACTURING 1998, PROCEEDINGS | 1998年

关键词：

D O I：

10.1109/ADHES.1998.742013

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

Adhesives used in electronic applications are subject to high cyclic shear stresses resulting from differential thermal expansion of the bonded materials. In this study, an attempt has been made to experimentally determine the dependence of the fatigue life of two packaging epoxy adhesives on: temperature, peak cycling stress as a fraction of adhesion strength, and cyclic frequency. Both epoxies were used to bond surfaces of aluminum and silicon. Tensile lap-shear specimens were used.

引用

页码：116 / 124

页数：9